MICRO-EPSILON thicknessCONTROL RTP 8301.EO Betriebsanleitung Seite 75

0 1
1.1
1L1
11.5
24V2
L1 L2 L3 13
-2Q1
ME 0264120
T1 T2 T3 14
master switch
I1
13.0
24V_SV
17.6
1 14
-2F1
C6A
2 13
ME 0369018
1.1 1.2
1N 1PE
-2M1
L N PE
cooling device
300W /230V
ME 0735335.01
Temperature: 35°C
1
Date 21.04.2021
Ed. by 11000108
Appr
Modification Date Name Original
2 3
1.6
24V_USV
dubl 1,5
-2F2
DC-fuse
ME 0369029
1
-9K1
/9.2
2
dubl 1,5
11.6 13.3
24V3 ST1
3 4 5
fault
T>40°C
Diese Zeichnung ist Eigentum der Firma This drawing is the property of MICRO-
MICRO-EPSILON und darf ohne unsere EPSILON and must not be copied or
Genehmigung weder kopiert noch brought to the knowledge of a third
dritten Personen mitgeteilt werden. party without our authorization.
Replacement for Replaced by
4 5
+24V ON ON 13 14 +24V
1 1 1 1
6 2 6 2 6 2 6 2
4 4 4 4
GND OUT1 OUT2 OUT3 OUT4 GND
-2X1
1
DC-Sicherung:
OUT1: Bus, sensoric, limit switch
OUT2: Panel-PC
OUT3: Servomotor
OUT4: Reserve
K211035
thicknessCONTROL
RTP 8301.CT
6 7
9.1 11.2
0V_PPC 0V_BUS1 PE_PPC
1.6 17.7 20.9
0V_USV 0V_SV PE_X
2 3 4
GNYE
-PE
Master switch, cooling device, dc-fuse
4350039.85
8 9
9.2
7
= ANL
+ ET1
Page 2
Pg 20