Repair Procedures And Techniques - General; Table 6-1. Lead Free Solder Wire Part Number List; Table 6-2. Lead Free Solder Paste Part Number List - Motorola P100 Serie Servicehandbuch

Maintenance – Full Keypad Models:Repair Procedures and Techniques – General
6.4 Repair Procedures and Techniques – General
Note Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards – examples shown below) were developed and assembled using environmentally
preferred components and solder assembly techniques that meet or exceed compliance
to the European Union's ROHS and WEEE directives (Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC and Restriction of Hazardous Substances
(ROHS) Directive 2002/95/EC). To maintain product compliance and reliability, use only
the Motorola specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products will carry the EPP
Marking, shown below, on the printed circuit board (PCB). This marking provides
information to those performing assembly, servicing and recycling operation on this
product, adhering to the JEDEC standard #97. The EPP Marking takes the form of a
label or marking on the PCB.
Any rework or repair on Environmentally Preferred Products must be done using the appropriate
lead-free solder wire and solder paste as stated in the following tables:
Motorola Part
Number
1088929Y01 95.5Sn/3.8Ag/0.7Cu
Motorola Part Manufacturer Part
Number
1085674C03 NC
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical
replacement part is not locally available, check the parts list for the proper Motorola part number.
Orders for replacement parts which are listed in the "Parts List" section of this manual, should be
placed directly on Motorola's local distribution organization or via Motorola Online.
Rigid Circuit Boards
This family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not
accessible, some special considerations are required when soldering and unsoldering components.
The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise
care to avoid pulling the plated circuit out of the hole.

Table 6-1. Lead Free Solder Wire Part Number List

Alloy Flux Type
RMA Version

Table 6-2. Lead Free Solder Paste Part Number List

Viscosity
Number
- -
SMQ230 900 1000KCPs
Brookfield(5rpm)
Flux Content Melting
by Weight Point
-
2.7 3.2% 217C
Type Composition & Percent Metal
Type 3 95.5%Sn
-
( 325/+500)
Supplier Part
Diameter
number
52171 0.015"
Temperature
- -
3.8%Ag 0.7%Cu 217 Degree C
89.3%
6-3
Weight
1lb spool
Liquidus