Emerson FOUNDATION Fieldbus Interface Bedienungsanleitung Seite 4

Safe Use Instructions – F
CPU Specifications
POWER (CPU)
3.56 W at 24 V dc (input supply 10 to 30 V dc).
MATERIALS
Case: Acrylonitrile Butadiene Styrene (ABS)
Plastic.
Wire Channel Covers: Polypropylene Plastic.
Modules: Thermoplastic polyester, solvent-
resistant
ENVIRONMENTAL
Operating Temp.: –40° to +75°C.
Storage Temp.: –40° to +85°C.
Relative Humidity: IEC68-2-3; 5–95% non-
condensing.
Vibration: IEC68-2-6; 0.15 mm or 20 m/sec
Mechanical Shock: IEC68-2-27; 11
milliseconds, sinusoidal 50Gs non-operating, 15
Gs operating
Thermal Shock: IEC68-2-14; Air to air from –
20° to 85°C
WEIGHT
Housing, backplane, and CPU: 1.65 kg
H1 Module Specifications
POWER (CPU)
1.18 W (from internal power conditioner or
external power supply)
OVER-VOLTAGE PROTECTION
± 36 V dc, fieldbus connections
+ 28 V dc, alarm connections
CONDITIONED POWER OUTPUT
18 to 24 V dc; 125 mA maximum; 150 mA over-
current fault indication
TERMINATOR
H1 module with conditioned power option: 100 Ω
1%, 1 uF, 50 V.
SEGMENT MODULE IMPEDENCE
Compliance with FF standards
WEIGHT
100 g
Fieldbus Interface
OUNDATION
2
Common Specifications
APPROVALS
Evaluated to the following European Standards
(EMC):
EN55011 (Emissions).
EN61000-4-2 (Electrostatic Discharge Immunity).
EN61000-4-3 (Electromagnetic Field Immunity)
EN61000-4-4 (Electrical Fast Transients Immunity).
EN61000-4-6 (Conducted Immunity)
Note: Meets performance Criterion B for immunity
Evaluated to the following European Standards
(ATEX):
EN50014 (1997) +A1 +A2.
EN60079-15 (2003).
Certified by Sira as Model W40203.
Product Markings for Hazardous Locations:
EEx nA IIC T4 – 40°C ≤ T
II 3 G.
Cert. No. Sira 05ATEX4046X
MOUNTING THE FFI
You can mount the FFI as either a standalone unit or
as an integral part of a ROC827. The ROC827
supports a maximum of four backplanes. If the
ROC827 already contains four backplanes, you
must remove one backplane and replace it with the
FFI.
1. You receive the FFI in a box. Remove it from the
box. The CPU and H1 modules are installed at
the factory.
2. Find a suitable location for the FFI. Always install
the FFI in a user-supplied enclosure, as the FFI
requires protection from direct exposure to rain,
snow, ice, blowing dust or debris, and corrosive
atmospheres. If you install the FFI outside a
building, place the FFI in an IP54 (or better) rated
enclosure.
Note: Seal any holes you make in the enclosure
for this purpose to ensure maintenance of
the required IP54 rating.
When choosing an enclosure, be sure to check
all clearances. Provide adequate clearance for
wiring and service. See Figure 2 and Figure 3.
Form A6296
Page 2
to ≤ +75°C)
amb