Heat Dissipation From Power Componentry; General Basics - Packaging; Delivery - Fronius Transpocket 1500 Erdstrom Serviceanleitung, Ersatzteilliste

Heat dissipation
from power
componentry
(continued)
Abb.4
Screwing the power component to the heat sink
The mounting surface of the power component must be clean and free of particles.
- Clean the mounting surface of the heat sink with contact spray and a non-linting
- Use fine grinding paper (grain P500 or finer) to remove any contamination or
- Clean the mounting surface of the heat sink with contact spray and a non-linting
- To begin with, only tighten the fixing screws very gently
- Before tightening the fixing screws, ensure that the power component is lying flat
-

General basics - packaging

Delivery

Only ship the TP 1500 power source in its original packaging.
The inside packaging consists of one supporting element at the underside of the power
source, and one at the top. The outside packaging is a coated corrugated cardboard
box with a carrying handle.
Electronic components and power components must always be packed in an ESD-
compatible manner. The most suitable packaging for this is insulating material (plastic),
which should completely enclose the packed component.
Each of the components inside the packaging must be wrapped separately in insulating
material.
cloth
unevenness on the mounting surface of the heat sink
cloth again
and without any gaps on the mounting surface
Note! When tightening the fixing screws, do not exceed a torque of 2.2 Nm.
Tightening with more than 2.2 Nm can seriously damage the power
component.
Tighten the fixing screws with a torque of 2 Nm (max. 2.2 Nm)
Note! Where several components are packed together, they must not be
allowed to touch one another.
If too thick a layer of heat-transfer
compound is applied, this also impairs
heat transfer, and the transistor module
may break when the fixing screws are
tightened.
- Roll the compound approx. two or
three times, until the underside of the
transistor module is completely
covered
30
Note! If the heat-transfer
compound is not applied to the
component in a complete, gap-
free layer, this may result in heat-
transfer problems.