jbc Advanced TE 5400 Instruktionshandbuch Seite 9

ENGLISH
4) Use the heater like the previous case,
advancing slowly from one extreme to
another of the pins line.
(*) Alloy 62 Sn/ 36 Pb/ 2 Ag Type RMA/CMA.
For desoldering
Temperature from 400 to 450°C (752 to 842°F),
an air flowrate from 7 to maximum, depending
on the size of the component.
SEL T
400ºC
Depending on the size of the integrated circuit
to be desoldered, you will have to use:
A) Protector + trípod.
B) Extractor.
C) Trípod.
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
AIR SELt
50% 2:00
- Use the SUCTION button to start the pump
and then place the tripod. Press the suction
cup until it sticks onto the component.
- Use the pedal or the HEAT button to start the
self-contained hot-air pump, directing it with
a circular movement at the component
terminals and taking care to distribute the
heat evenly.
- When the soldering flux turns liquid the
extractor will automatically lift the component.
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