jbc Advanced TE 5400 Instruktionshandbuch Seite 7

ENGLISH
RECOMMENDATIONS FOR SOLDERING
AND DESOLDERING
In hot-air soldering and desoldering processes,
melting point is reached as a result of the heat
applied, the function of the air being to bring the
required heat to bear on the components. It is
therefore very important to select the lowest
possible air flow, and we recommend that the
heater be used without a nozzle whenever
possible, thus avoiding components being
shifted and solder being driven out.
The following values are show as a guide for
each application:
Soldering
small 300°C (572°F)
components
Soldering
medium and 350°C (662°F)
large comp.
Desoldering 300°C (572°F)
small
components 350°C (662°F)
Desoldering 400°C (752°F)
medium and
large comp. 450°C (842°F)
The nozzles are removed from the heather
through the special bushing on the stand.
Air
Temp.
Flow
1 - 2
1 - 7
or 1 - 4
7
or or
Maximum
For soldering
Process for small SMD components of two or
three pins such as heating elements,
capacitors, transistors, etc:
1) If the component has been desoldered
previously, any traces of solder left on the
circuit pads must be cleaned up by
desoldering iron suction. We recommend
our DD 5700 sold / desold kit.
2) Temperature 300°C (572°F), air flowrate 1-2.
SEL T
300ºC
3) Apply soldering cream (*) for SMD on the
circuit pad. For application we recommend
our model DP 6070 dispenser or any other
available on the market.
6
AIR SELt
20% 2:00