jbc Advanced TE 5400 Instruktionshandbuch Seite 8

The amount of cream used for each soldering
operation should be just sufficient to cover
the trace of the component pin. Any excess
cream may extend over the circuit on melting
and cause short-circuits.
4) Take the component with a JBC PK 6060 or
DP 6070 Pick & Place or otherwise with fine
pincers, place it in position on the circuit and
hold it in place.
5 ) Move the nozzle tip to about 15-20 mm
from the component terminal and direct
the hot air flow against it. Wait for a few
seconds until the cream flux liquefies.
During this time the terminal will be
preheated to about 100°C (212°F). Move
the tip closer to 8-10 mm and hold it just
until the tin alloy melts. Immediately
remove the heater. If the solder area is
overheated, it oxidizes making soldering
difficult and there is a risk of damaging
the component or the printed circuit
copper adhesive.
Process for printed circuits in PLCC, QFP, SO
encapsulations:
1) Temperature of about 350°C (662°F), air
flowrate 1-7.
SEL T
350ºC
2) Apply soldering cream (*) for SMD on the
circuit pads, forming a bead transverse to
the direction of the tracks. In this operation,
it is vital not to apply too much cream,
since any excess may lead to solder
cross-connections being formed between
the component's pins.
3) Take the component with the PK 6060 or DP
6070 Pick & Place, place it in position on the
circuit and hold it in place.
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