Placing the Specimen
Pouring Resin over the
Specimen
Installing the Top Closure
The Mounting Process
Heating On
Heating Off
Removing the Top Closure
LaboPress-1
Instruction Manual
Quick Reference Card
Press and hold RAM UP
limit.
Apply "Mould Release Agent" to the surface of the lower ram.
Place the specimen on the ram.
Press and hold RAM DOWN
limit.
Pour a suitable amount of resin into the cylinder using a
funnel. Use sufficient resin to allow for shrinkage.
Remove resin dust from the upper part of the mounting
cylinder.
Clean the cylindrical surface of the upper ram. Cured resin
can easily be removed without damage to the surface of the
ram using the scraper supplied.
Apply "Mould Release Agent" to all accessible surfaces of the
upper ram.
Place the top closure with the upper ram on the mounting
cylinder.
Press the top closure straight down, turning it counter-
clockwise until you hear a click.
Press the top closure down and turn it clockwise until it
reaches its lower limit.
Turn the top closure a quarter of a turn back.
Press HEATING 180°C or 150°C to select the temperature.
Press HEATING ON
Press RAM UP
gauge, is as desired.
Maintain the force during the heating period.
Press HEATING OFF
Open the cooling water tap on the water mains.
Maintain the force (pressure) during the cooling period.
When the cooling period is finished, close the cooling water
tap on the water mains.
When the mounting process is finished:
Press RAM DOWN
Turn the top closure counter-clockwise until released from the
thread.
Press RAM UP
Place the top closure in the top closure holder.
O
to raise the lower ram to its upper
N
to lower the ram to its lower
¹
to switch on the heating unit.
O
until the force (pressure), indicated on the
º
to switch off the heating unit.
N
shortly to relieve the pressure.
O
to raise the lower ram to its upper limit.
21