2.2. Application
1. It is suitable for soldering and desoldering various kinds of components
such as SOIC, QFP, PLCC, BGA chips.
2. It is suitable for heat shrinkage, paint and sticker removal, preheating,
sterilizing, glue connecting etc.
2.3. Characteristics
•
3 Memory locations
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Digital calibration function
•
Automatic standby and hibernation
•
Constant temperature thanks to closed loop control
•
Automatic cooling system
•
Lightweight handle
2.4. Specification
Power
Display
Airflow
Temperature range
Heating element
Dimension
Weight
Specifications and design subject above may be changed without notice.
580W
LED (resolution 1℃)
Max. 40/min
100 – 500 °C
Ceramic Heating element
110mm(W)×151mm(L)×180mm(H)
1.6kg
3
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