Functional Description - Kurtz Ersa X-TOOL VARIO Bedienungsanleitung

Functional description

6. Functional description
6.1 Selection of the right desoldering temperature
Standard values for set temperatures:
Not plated-through PCBs and
smaller components such as
resistors, capacitors and ICs
Single-layer, plated-through PCBs
Multi-layer, plated-through PCBs
Multilayer and high-mass
components
6.2 Selection of the right desoldering tip
Ersa desoldering tips are modelled on the meniscus of the solder joint so as to ensure
optimal heat transfer. Select the internal diameter of the desoldering tip in such a way
that a small annular clearance of about 0.1 to 0.2 mm is left between the connection to
be desoldered and the exhaust duct, so as to be able to suction the solder residues.
6.2.1 Desoldering tip change
A desoldering tip can be changed using the tip holder fitted to the supporting stand or
the included tip changing pliers.
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Caution! Material damage due to high temperatures is possible!
Always select the lowest possible desoldering temperature for the task to
be performed. Please keep in mind that higher temperatures also mean
higher wear of the desoldering tip. Excessively high temperatures can also
damage the board and components.
Caution! Risk of burns!
Desoldering tips are hot after use. Do not bring hot desoldering tips into
contact with the skin or heat-sensitive substances and objects.
3BA00215 • 2016-07-11 • Rev. 3
Leaded solder set temperature
approx. 270°C
approx. 270°C – 300°C
approx. 300°C – 330°C
approx. 350°C – 380°C
Unleaded solder set temperature
approx. 300°C – 320°C
approx. 300°C – 320°C
approx. 330°C – 360°C
approx. 400°C – 430°C
ersa X-TOOL VARIO