Specifications - ASROCK B560M-HDV Handbuch

1.2 Specifications

Platform
CPU
Chipset
Memory
Expansion
Slot
6
• Micro ATX Form Factor
• Solid Capacitor design
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• Supports 10 Gen Intel® Core
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Intel® Core Processors (LGA1200)
• Digi Power design
• 6 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® B560
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
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• 11 Gen Intel® Core
un-buffered memory up to 5000+(OC)*
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• 10 Gen Intel® Core
un-buffered memory up to 4600+(OC)*
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* 11 Gen Intel® Core
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Core (i3), Pentium® and Celeron® support DDR4 up to 2666.
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* 10 Gen Intel® Core
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Core (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
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11 Gen Intel® Core Processors
• 1 x PCI Express 4.0 x16 Slot*
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10 Gen Intel® Core Processors
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 2 x PCI Express 3.0 x1 Slots
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Processors and 11
Processors support DDR4 non-ECC,
Processors support DDR4 non-ECC,
(i9/i7/i5) support DDR4 up to 2933;
(i9/i7) support DDR4 up to 2933;
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Gen