Beckhoff CB3055 Handbuch Seite 4

Inhalt
4.3.10 Network Stack ..................................................................................................................... 56
4.3.11 CPU PPM Configuration ..................................................................................................... 57
4.3.12 Intel(R) GigabitNetworkConnection .................................................................................... 58
4.4 Chipset ........................................................................................................................................ 60
4.4.1 PCH-IO Configuration ......................................................................................................... 61
4.4.2 System Agent (SA) Configuration ....................................................................................... 68
4.5 Boot ............................................................................................................................................ 77
4.5.1 CSM Parameters ................................................................................................................ 79
4.6 Security ....................................................................................................................................... 80
4.6.1 Secure Boot Policy ............................................................................................................. 81
4.6.2 Key Management................................................................................................................ 82
4.7 Save & Exit ................................................................................................................................. 84
4.8 BIOS-Update .............................................................................................................................. 85
5 Mechanische Zeichnung .................................................................................................................... 86
5.1 Leiterplatte: Bohrungen .............................................................................................................. 86
5.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 87
5.3 Leiterplatte: Heat Sink ................................................................................................................ 88
6 Technische Daten .............................................................................................................................. 89
6.1 Elektrische Daten ....................................................................................................................... 89
6.2 Umgebungsbedingungen ........................................................................................................... 89
6.3 Thermische Spezifikationen ....................................................................................................... 90
7 Support und Service .......................................................................................................................... 91
7.1 Beckhoff-Support ........................................................................................................................ 91
7.2 Beckhoff-Service ........................................................................................................................ 91
7.3 Beckhoff-Firmenzentrale ............................................................................................................ 91
I Anhang: Post-Codes .......................................................................................................................... 93
II Anhang: Ressourcen ......................................................................................................................... 95
IO-Bereich .............................................................................................................................................. 95
Memory-Bereich ..................................................................................................................................... 95
Interrupt .................................................................................................................................................. 95
PCI-Devices ........................................................................................................................................... 96
Ressourcen: SMB-Devices .................................................................................................................... 96
Seite 4 Beckhoff New Automation Technology CB3055