Beckhoff CB4055 Handbuch Seite 4

Inhalt
5.3.7 Super IO Configuration ....................................................................................................... 52
5.3.8 H/W Monitor ........................................................................................................................ 54
5.3.9 Serial Port Console Redirection ......................................................................................... 56
5.3.10 Network Stack ..................................................................................................................... 58
5.3.11 CPU PPM Configuration ..................................................................................................... 59
5.3.12 Intel(R) GigabitNetworkConnection .................................................................................... 60
5.4 Chipset ........................................................................................................................................ 62
5.4.1 PCH-IO Configuration ......................................................................................................... 63
5.4.2 System Agent (SA) Configuration ....................................................................................... 70
5.5 Boot ............................................................................................................................................ 78
5.5.1 CSM Parameters ................................................................................................................ 80
5.6 Security ....................................................................................................................................... 81
5.6.1 Secure Boot Policy ............................................................................................................. 82
5.6.2 Key Management................................................................................................................ 83
5.7 Save & Exit ................................................................................................................................. 85
5.8 BIOS-Update .............................................................................................................................. 86
6 Mechanische Zeichnung .................................................................................................................... 87
6.1 Leiterplatte: Bohrungen .............................................................................................................. 87
6.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 88
6.3 Leiterplatte: Kühlkörper/Die Center ............................................................................................ 89
7 Technische Daten .............................................................................................................................. 90
7.1 Elektrische Daten ....................................................................................................................... 90
7.2 Umgebungsbedingungen ........................................................................................................... 90
7.3 Thermische Spezifikationen ....................................................................................................... 91
8 Support und Service .......................................................................................................................... 92
8.1 Beckhoff-Support ........................................................................................................................ 92
8.2 Beckhoff-Service ........................................................................................................................ 92
8.3 Beckhoff-Firmenzentrale ............................................................................................................ 92
I Anhang: Post-Codes .......................................................................................................................... 94
II Anhang: Ressourcen ......................................................................................................................... 96
IO-Bereich .............................................................................................................................................. 96
Memory-Bereich ..................................................................................................................................... 96
Interrupt .................................................................................................................................................. 96
PCI-Devices ........................................................................................................................................... 97
Ressourcen: SMB-Devices .................................................................................................................... 97
Seite 4 Beckhoff New Automation Technology CB4055