Beckhoff CB3053 Handbuch Seite 4

Inhalt
5.4.2 Hard Disk Boot Priority ..................................................................................................... 43
5.5 Advanced Chipset Features.................................................................................................. 44
5.6 Integrated Peripherals .......................................................................................................... 45
5.6.1 OnChip IDE Devices......................................................................................................... 46
5.6.2 Onboard Devices.............................................................................................................. 47
5.6.3 SuperIO Devices .............................................................................................................. 48
5.6.4 USB Device Setting.......................................................................................................... 49
5.7 Power Management Setup ................................................................................................... 50
5.7.1 HPET Feature .................................................................................................................. 51
5.7.2 Intel DTS Feature............................................................................................................. 52
5.8 PnP/PCI Configuration.......................................................................................................... 53
5.8.1 IRQ Resources................................................................................................................. 54
5.9 PC Health Status.................................................................................................................. 55
5.10 Load Fail-Safe Defaults ........................................................................................................ 57
5.11 Load Optimized Defaults....................................................................................................... 57
5.12 Set Password ....................................................................................................................... 57
5.13 Save & Exit Setup................................................................................................................. 57
5.14 Exit Without Saving .............................................................................................................. 57
6 BIOS-Update ................................................................................................................................ 58
7 Mechanische Zeichnung ............................................................................................................... 59
7.1 Leiterplatte: Bohrungen ........................................................................................................ 59
7.2 Leiterplatte: Pin-1-Abstände.................................................................................................. 60
7.3 Leiterplatte: Die Center......................................................................................................... 61
8 Technische Daten......................................................................................................................... 62
8.1 Elektrische Daten ................................................................................................................. 62
8.2 Umgebungsbedingungen...................................................................................................... 62
8.3 Thermische Spezifikationen.................................................................................................. 63
9 Support und Service ..................................................................................................................... 64
9.1 Beckhoff-Support.................................................................................................................. 64
9.2 Beckhoff-Service .................................................................................................................. 64
9.3 Beckhoff-Firmenzentrale....................................................................................................... 64
I Anhang: Post-Codes..................................................................................................................... 65
II Anhang: Ressourcen .................................................................................................................... 68
A IO-Bereich ................................................................................................................................ 68
B Memory-Bereich ....................................................................................................................... 68
C Interrupt.................................................................................................................................... 68
D PCI-Devices ............................................................................................................................. 69
E Ressourcen: SMB-Devices ....................................................................................................... 69
Seite 4 Beckhoff New Automation Technology CB3053