5
Zugentlastung ........................................................................ 17
6
7
8
8.1
Daten-Breakpoint ........................................................................ 27
9
9.1
Schirmung ................................................................................... 28
9.2
ESD-Schutz .................................................................................. 28
10 Montage ................................................................................. 29
04.11.2020
S-DIAS CPU-MODUL
CP 101
Seite 3