Beckhoff CB3067 Originalbetriebsanleitung Seite 4

Inhaltsverzeichnis
8.3.9 AMI Graphic Output Protocol Policy ................................................................................ 48
8.3.10 PCI Subsystem Settings .................................................................................................. 49
8.3.11 USB Configuration ........................................................................................................... 51
8.3.12 NVMe Configuration ........................................................................................................ 52
8.3.13 Power Controller Options................................................................................................. 53
8.3.14 SATA und RST Configuration.......................................................................................... 54
8.3.15 AMT Configuration........................................................................................................... 57
8.3.16 TLs Auth Configuration .................................................................................................... 61
8.3.17 Network Stack Configuration ........................................................................................... 64
8.3.18 Network Stack Configuration enabled ............................................................................. 65
8.3.19 Intel I210 Gigabit Network Connection ............................................................................ 66
8.3.20 Intel Rapid Storage Technology ...................................................................................... 68
8.3.21 Intel Ethernet Connection(2) I219-LM.............................................................................. 69
8.3.22 Driver Health.................................................................................................................... 71
8.4 Chipset ............................................................................................................................................ 72
8.4.1 System Agent (SA) Configuration.................................................................................... 73
8.4.2 PCH-IO Configuration...................................................................................................... 75
8.5 Security............................................................................................................................................ 81
8.5.1 Secure Boot ..................................................................................................................... 82
8.6 Boot ................................................................................................................................................. 97
8.6.1 Fixed Boot Order Parameters.......................................................................................... 98
8.7 Save & Exit ...................................................................................................................................... 99
8.8 BIOS-Update ................................................................................................................................. 100
9 Mechanische Zeichnung ....................................................................................................................... 101
9.1 Leiterplatte: Outlines...................................................................................................................... 101
9.2 Leiterplatte: Bohrungen ................................................................................................................. 102
9.3 Leiterplatte: Pin-1-Abstände .......................................................................................................... 103
9.4 Leiterplatte: Heat Sink ................................................................................................................... 103
10 Technische Daten .................................................................................................................................. 105
10.1 Elektrische Daten .......................................................................................................................... 105
10.2 Umgebungsbedingungen .............................................................................................................. 105
10.3 Thermische Spezifikationen .......................................................................................................... 106
11 Support und Service.............................................................................................................................. 107
11.1 Beckhoff-Support ........................................................................................................................... 107
11.2 Beckhoff-Service ........................................................................................................................... 107
11.3 Beckhoff-Firmenzentrale ............................................................................................................... 107
12 Anhang I: Post-Codes ........................................................................................................................... 108
13 Anhang II: Ressourcen.......................................................................................................................... 109
13.1 Interrupt ......................................................................................................................................... 109
13.2 PCI-Devices................................................................................................................................... 110
13.3 SMB-Devices ................................................................................................................................. 111
4 Version: 1.0 CB3067