Beckhoff CB1067 Originalbetriebsanleitung Seite 4

Inhaltsverzeichnis
6.3.7 Hardware Monitor ............................................................................................................ 53
6.3.8 Serial Port Console Redirection....................................................................................... 54
6.3.9 AMI Graphic Output Protocol Policy ................................................................................ 59
6.3.10 PCI Subsystem Settings .................................................................................................. 60
6.3.11 USB Configuration ........................................................................................................... 62
6.3.12 NVMe Configuration ........................................................................................................ 63
6.3.13 Power Controller Options................................................................................................. 64
6.3.14 SATA And RST Configuration ......................................................................................... 65
6.3.15 AMT Configuration........................................................................................................... 68
6.3.16 TLs Auth Configuration .................................................................................................... 72
6.3.17 Network Stack Configuration ........................................................................................... 74
6.3.18 Network Stack Configuration enabled ............................................................................. 75
6.3.19 Intel Rapid Storage Technology ...................................................................................... 75
6.3.20 Intel I210 Gigabit Network Connection ............................................................................ 76
6.3.21 Intel Ethernet Connection(2) I219-LM.............................................................................. 78
6.3.22 Driver Health.................................................................................................................... 80
6.4 Chipset ............................................................................................................................................ 81
6.4.1 System Agent (SA) Configuration.................................................................................... 82
6.4.2 PCH-IO Configuration...................................................................................................... 84
6.5 Security............................................................................................................................................ 90
6.5.1 Secure Boot ..................................................................................................................... 91
6.6 Boot ............................................................................................................................................... 107
6.6.1 Advanced Fixed Boot Order Parameters....................................................................... 108
6.7 Save & Exit .................................................................................................................................... 109
6.8 BIOS-Update ................................................................................................................................. 109
7 Mechanische Zeichnung ....................................................................................................................... 110
7.1 Leiterplatte: Abmessungen ............................................................................................................ 110
7.2 Leiterplatte: Montagebohrungen.................................................................................................... 111
8 Technische Daten .................................................................................................................................. 112
8.1 Elektrische Daten .......................................................................................................................... 112
8.2 Umgebungsbedingungen .............................................................................................................. 112
8.3 Thermische Spezifikationen .......................................................................................................... 113
9 Support und Service.............................................................................................................................. 114
9.1 Beckhoff-Support ........................................................................................................................... 114
9.2 Beckhoff-Service ........................................................................................................................... 114
9.3 Beckhoff-Firmenzentrale ............................................................................................................... 114
10 Anhang I: Post-Codes ........................................................................................................................... 115
11 Anhang II: Ressourcen.......................................................................................................................... 116
11.1 Interrupt ......................................................................................................................................... 116
11.2 PCI-Devices................................................................................................................................... 117
11.3 SMB-Devices ................................................................................................................................. 118
4 Version: 1.0 CB1067