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XR-CA600/CA600V/CA600X
TABLE OF CONTENTS
1.
Location of Controls ....................................................... 3
Setting the Clock ............................................................. 4
2.
2-1. Disassembly Flow ........................................................... 8
2-2. Mechanism Deck (MG-25G-136) ................................... 8
2-3. MAIN Board ................................................................... 9
2-4. Heat Sink (ISO2P) .......................................................... 9
3.
3-1. Housing ........................................................................... 10
3-2. Arm (Suction) ................................................................. 10
3-3. Lever (LDG-A)/(LDG-B) ............................................... 11
3-4. Gear (LDG-FT) ............................................................... 11
3-5. Guide (C) ......................................................................... 12
4.
5.
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13
6.
Schematic Diagrams ....................................................... 14
6-2. Printed Wiring Board - MAIN Board - ......................... 15
6-3. Schematic Diagram - MAIN Board (1/3) - ................... 16
6-4. Schematic Diagram - MAIN Board (2/3) - ................... 17
6-5. Schematic Diagram - MAIN Board (3/3) - ................... 18
6-6. Printed Wiring Board - SUB Board - ............................ 19
6-7. Schematic Diagram - SUB Board - ............................... 19
- KEY Board (XR-CA600/CA600X) - ......................... 20
- KEY Board (XR-CA600V) - ...................................... 21
6-10. Schematic Diagram - KEY Board - .............................. 22
6-11. IC Pin Function Description ........................................... 26
7.
7-1. General Section ............................................................... 29
7-2. Front Panel Section ......................................................... 30
7-3. Mechanism Deck Section (MG-25G-136) ..................... 31
8.
2
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
• Do not touch the soldering iron on the same conductor of the
• Be careful not to apply force on the conductor when soldering
....................... 13
............................... 32
aged by heat.
ing repairing.
circuit board (within 3 times).
or unsoldering.
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