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Verfügbare Sprachen
Verfügbare Sprachen
3. Installation
Remove all packaging materials from the device
Do not place the device in a hot, wet or very humid environment.
Place the device on a level, horizontal
•
The socket must be easily accessible so that the power supply can
be disconnected quickly in case of an emergency.
Before you connect the device, compare the connection data for
the device (voltage and frequency) on the type plate with that of
your mains power supply. This data must match to avoid damage
to the
Keep the connection
edges.
Do not to bend the connection cable or pull it too tightly.
Do not allow the connection
sons may trip and fall.
4. Handling
4.1
Instructions
• Always wait for a lamination process to finish before starting the
next.
4.2 Switching
Press the on/off switch O
The device automatically heats to the correct temperature for la-
minating films with a thickness of 80 gm. The ready lamp (2) turns
green as soon as the device is ready.
Basic
A41
and Assembly
device
and Operation
for
use
on the device
surface
cable away from hot surfaces and sharp
cable to hang over corners,
to switch
on the
device.
so that it is stable.
as per-
5
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