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1.4.7 Boot Order ............................................................................................................ 137
1.4.8 Wiederherstellen der BIOS Defaultwerte .............................................................. 137
1.5 BIOS und Firmware (MTCX) Upgrade ........................................................................ 138
1.5.1 BIOS Upgrade Vorgang ........................................................................................ 138
1.5.2 MTCX Firmware Upgrade ..................................................................................... 139
1.5.3 User Boot Logo ..................................................................................................... 140
1.6 CMOS Backup ............................................................................................................. 140
2. Windows CE ..................................................................................................................... 141
2.1 Allgemeines ................................................................................................................. 141
2.1.1 Vorteile / Features ................................................................................................. 141
2.2 Unterschiede der verschiedenen CE Versionen (Pro - ProPlus) ................................. 142
2.3 Installation ................................................................................................................... 142
2.3.1 B&R eMbedded OS Installer ................................................................................. 142
3. Windows XP embedded ................................................................................................... 143
3.1 Allgemeines ................................................................................................................. 143
3.2 Features mit FP2007 (Feature Pack 2007) ................................................................. 143
3.3 Installation ................................................................................................................... 144
4. Automation Device Interface - ADI ................................................................................... 145
5. B&R Key Editor ................................................................................................................. 146
Kapitel 5: Normen und Zulassungen .......................................... 147
1. Gültige europäische Richtlinien ........................................................................................ 147
2. Normenübersicht .............................................................................................................. 147
3. Störaussendungsanforderungen (Emission) .................................................................... 149
3.1 Netzgebundene Emission ........................................................................................... 149
3.2 Störaussendung, Elektromagnetische Strahlung ........................................................ 150
4. Störfestigkeitsanforderung (Immunität) ............................................................................. 151
4.1 Elektrostatische Entladung (ESD) ............................................................................... 152
4.2 Hochfrequente elektromagnetische Felder (HF Feld) ................................................. 152
4.3 Schnelle transiente elektrische Störgrößen (Burst) ..................................................... 152
4.4 Stoßspannungen (Surge) ............................................................................................ 153
4.5 Leitungsgeführte Störgrößen ....................................................................................... 153
4.6 Magnetfelder mit energietechnischen Frequenzen ..................................................... 154
4.7 Spannungseinbrüche, -schwankungen und Kurzzeitunterbrechungen ....................... 154
4.8 Gedämpfte Schwingungen .......................................................................................... 154
5. Mechanische Bedingungen .............................................................................................. 155
5.1 Vibration Betrieb .......................................................................................................... 155
5.2 Vibration Transport (verpackt) ..................................................................................... 156
5.3 Schock Betrieb ............................................................................................................ 156
5.4 Schock Transport (verpackt) ....................................................................................... 156
5.5 Kippfallen ..................................................................................................................... 157
5.6 Freier Fall (verpackt) ................................................................................................... 157
6. Klimabedingungen ............................................................................................................ 158
6.1 Worst Case Betrieb ..................................................................................................... 158
6.2 Trockene Wärme ......................................................................................................... 158
6.3 Trockene Kälte ............................................................................................................ 158
Panel PC 300 Anwenderhandbuch V 1.00
Inhaltsverzeichnis
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Kapitel
