General Memory Module Installation Guidelines - Dell EMC PowerEdge M830 Handbuch

Kanal 1: Speichersockel D2, D6 und D10
Kanal 2: Speichersockel D3, D7 und D11
Kanal 3: Speichersockel D4, D8 und D12
Die folgende Tabelle enthält die Speicherbelegungen und Taktraten für die unterstützten Konfigurationen.
Tabelle 20. Unterstützte Konfigurationen
DIMM-Typ DIMMs bestückt je
Kanal
RDIMM
LRDIMM

General memory module installation guidelines

Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for best performance:
● LRDIMMs, and RDIMMs must not be mixed.
● x4 and x8 DRAM based DIMMs can be mixed. For more information, see the Mode-specific guidelines section.
● A maximum of three single-rank or dual-rank RDIMMs can be populated in a channel.
● Up to three LRDIMMs can be populated regardless of rank count.
● Populate four DIMMs per processor (one DIMM per channel) at a time to maximize performance.
● If memory modules with different speeds are installed, they operate at the speed of the slowest installed memory module(s)
or slower depending on system DIMM configuration.
● Populate DIMMs based on the following processor-heat sink configurations.
● Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available. For
dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
● Populate all sockets with white release tabs first, black, and then green.
● Populate the sockets by highest capacity DIMM in the following order - first in sockets with white release levers and then
black. For example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB DIMMs in the sockets with white release tabs
and 8 GB DIMMs in the sockets with black release tabs.
● In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if you
populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
● Memory modules of different sizes can be mixed provided that other memory population rules are followed (for example, 4
GB and 8 GB memory modules can be mixed).
● Depending on mode-specific guidelines, populate four DIMMs per processor (one DIMM per channel) at a time to maximize
performance. For more information, see the Mode-specific guidelines section.
Table 21. Heat sink — processor configurations
Processor Processor Type (in
Configuration Watts)
Dual processor Up to 135 W
Quad processor Up to 105 W
120 W or 135 W
68 Einsetzen und Entfernen von bladekomponenten
Spannung
1
2 1,2 V
3
1
2
1,2 V
3
Heat
Sink
Width
74 mm
74 mm
94 mm
Taktrate (in MT/s)
2400, 2133 und 1866
2400, 2133 und 1866
1866
2400, 2133 und 1866
2400, 2133 und 1866
2.133
Number of DIMMs
Maximum System
Capacity
24
48
40 (Three DIMMs in channel
0 and channel 2 and two
DIMMs in channel 1 and
channel 3)
Maximaler DIMM-Rank je Kanal
Single- und Dual-Rank
Single- und Dual-Rank
Single- und Dual-Rank
Quad-Rank
Quad-Rank
Quad-Rank
Reliability, Availability, and
Serviceability (RAS) Features
24
48
32 (Two DIMMs per channel)