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Advanced Chipset Features
5.5 Advanced Chipset Features
DRAM Timing Selectable
x CAS Latency Time
x Active to Precharge Delay
x DRAM RAS# to CAS# Delay
x DRAM RAS# Precharge
x DRAM Data Integrity Mode
MGM Core Frequency
System BIOS Cacheable
Video BIOS Cacheable
Memory Hole At 15M-16M
Delayed Transaction
Delay Prior to Thermal
AGP Aperture Size (MB)
** On-Chip VGA Setting **
On-Chip VGA
On-Chip Frame Buffer Size
Boot Display
Panel Scaling
Panel Number
↑↓→←:Move Enter:Select +/-/PU/PD:Value F10:Save ESC:Exit F1:Help
F5: Previous Values F6: Fail-Safe Defaults F7: Optimized Defaults
ü DRAM Timing Selectable
Optionen:
By SPD / Manual
ü CAS Latency Time
Optionen:
2.5 / 2
ü Active to Precharge Delay
Optionen:
5 / 6 / 7
ü DRAM RAS# to CAS# Delay
Optionen:
2 / 3
ü DRAM RAS# Precharge
Optionen:
2 / 3
ü DRAM Data Integrity Mode
Optionen:
keine
ü MGM Core Frequency
Optionen:
Auto Max 266MHz /
400/266/133/200 MHz /
400/200/100/200 MHz /
400/200/100/133 MHz /
400/266/133/267 MHz /
400/333/166/250 MHz /
Auto Max 400/333 MHz
ü System BIOS Cacheable
Optionen:
Enabled / Disabled
ü Video BIOS Cacheable
Optionen:
Enabled / Disabled
ü Memory Hole At 15M-16M
Optionen:
Enabled / Disabled
Beckhoff New Automation Technology CB3050
Phoenix – AwardBIOS CMOS Setup Utility
Advanced Chipset Features
[By SPD]
2.5
7
3
3
Non-ECC
[Auto Max 266MHz]
[Enabled]
[Enabled]
[Disabled]
[Enabled]
[16 Min]
[64]
[Enabled]
[32MB]
[LFP]
[Off]
[ 800*600 *18b-sp]
Kapitel: BIOS-Einstellungen
Item Help
Seite 45
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