Beckhoff CB3064 Serie Handbuch Seite 4

Inhalt
6.1 Benutzung des Setups ............................................................................................................... 37
6.2 Main ............................................................................................................................................ 38
6.3 Advanced .................................................................................................................................... 40
6.3.1 Trusted Computing ............................................................................................................. 42
6.3.2 ACPI Settings ..................................................................................................................... 44
6.3.3 AMT Configuration .............................................................................................................. 45
6.3.4 SCH3114 Super IO Configuration ...................................................................................... 47
6.3.5 H/W Monitor ........................................................................................................................ 49
6.3.6 Serial Port Console Redirection ......................................................................................... 51
6.3.7 CPU Configuration .............................................................................................................. 55
6.3.8 Platform Misc Configuration Configuration ......................................................................... 58
6.3.9 SATA Configuration ............................................................................................................ 65
6.3.10 PCI Subsystem Settings ..................................................................................................... 68
6.3.11 Network Stack ..................................................................................................................... 70
6.3.12 Power Controller Options ................................................................................................... 71
6.3.13 Compatibility Support Module Configuration ...................................................................... 73
6.3.14 NVMe Controller and Drive Information ............................................................................. 74
6.3.15 USB Configuration .............................................................................................................. 75
6.4 Chipset ........................................................................................................................................ 76
6.4.1 System Agent (SA) Configuration ....................................................................................... 77
6.4.2 PCH-IO Configuration ......................................................................................................... 87
6.5 Security ....................................................................................................................................... 99
6.5.1 Secure Boot Menu ............................................................................................................ 100
6.6 Boot .......................................................................................................................................... 102
6.6.1 Fixed Boot Order Priority .................................................................................................. 104
6.7 Save & Exit ............................................................................................................................... 105
6.8 BIOS-Update ............................................................................................................................ 106
7 Mechanische Zeichnung .................................................................................................................. 107
7.1 Leiterplatte: Bohrungen ............................................................................................................ 107
7.2 Leiterplatte: Heat Sink .............................................................................................................. 108
7.3 Leiterplatte: Pin-1-Abstände ..................................................................................................... 109
7.4 Leiterplatte: Outlines ................................................................................................................. 110
8 Technische Daten ............................................................................................................................ 111
8.1 Elektrische Daten ..................................................................................................................... 111
8.2 Umgebungsbedingungen ......................................................................................................... 111
8.3 Thermische Spezifikationen ..................................................................................................... 112
9 Support und Service ........................................................................................................................ 113
9.1 Beckhoff-Support ...................................................................................................................... 113
9.2 Beckhoff-Service ...................................................................................................................... 113
9.3 Beckhoff-Firmenzentrale .......................................................................................................... 113
I Anhang: Post-Codes ........................................................................................................................ 114
II Anhang: Ressourcen ....................................................................................................................... 115
Interrupt ................................................................................................................................................ 115
PCI-Devices ......................................................................................................................................... 115
Ressourcen: SMB-Devices .................................................................................................................. 116
Seite 4 Beckhoff New Automation Technology CB3064-xxxx