Beckhoff CB3064 Serie Handbuch Seite 4

Inhalt
6.1 Benutzung des Setups ............................................................................................................... 37
6.2 Main ............................................................................................................................................ 38
6.3 Advanced .................................................................................................................................... 40
6.3.1 Platform Misc Configuration Configuration ......................................................................... 42
6.3.2 CPU Configuration .............................................................................................................. 46
6.3.3 Intel(R) I210 Gigabit Network Connection .......................................................................... 51
6.3.4 Intel(R) Ethernet Connection I219-LM ................................................................................ 53
6.3.5 Driver Health ....................................................................................................................... 54
6.3.6 Trusted Computing ............................................................................................................. 57
6.3.7 ACPI Settings ..................................................................................................................... 58
6.3.8 H/W Monitor ........................................................................................................................ 59
6.3.9 Serial Port Console Redirection ......................................................................................... 61
6.3.10 PCI Subsystem Settings ..................................................................................................... 62
6.3.11 Network Stack Configuration .............................................................................................. 64
6.3.12 Power Controller Options ................................................................................................... 65
6.3.13 Compatibility Support Module Configuration ...................................................................... 67
6.3.14 NVMe Controller and Drive Information ............................................................................. 68
6.3.15 USB Configuration .............................................................................................................. 69
6.3.16 SATA and RST Configuration ............................................................................................. 70
6.3.17 AMT Configuration .............................................................................................................. 74
6.4 Chipset ........................................................................................................................................ 80
6.4.1 System Agent (SA) Configuration ....................................................................................... 81
6.4.2 PCH-IO Configuration ......................................................................................................... 86
6.5 Security ..................................................................................................................................... 104
6.5.1 Secure Boot Menu ............................................................................................................ 105
6.6 Boot .......................................................................................................................................... 107
6.6.1 Fixed Boot Order Priority .................................................................................................. 109
6.7 Save & Exit ............................................................................................................................... 110
6.8 BIOS-Update ............................................................................................................................ 111
7 Mechanische Zeichnung .................................................................................................................. 112
7.1 Leiterplatte: Bohrungen ............................................................................................................ 112
7.2 Leiterplatte: Heat Sink .............................................................................................................. 113
7.3 Leiterplatte: Pin-1-Abstände ..................................................................................................... 114
7.4 Leiterplatte: Outlines ................................................................................................................. 115
8 Technische Daten ............................................................................................................................ 116
8.1 Elektrische Daten ..................................................................................................................... 116
8.2 Umgebungsbedingungen ......................................................................................................... 116
8.3 Thermische Spezifikationen ..................................................................................................... 117
9 Support und Service ........................................................................................................................ 118
9.1 Beckhoff-Support ...................................................................................................................... 118
9.2 Beckhoff-Service ...................................................................................................................... 118
9.3 Beckhoff-Firmenzentrale .......................................................................................................... 118
I Anhang: Post-Codes ........................................................................................................................ 119
II Anhang: Ressourcen ....................................................................................................................... 120
Interrupt ................................................................................................................................................ 120
PCI-Devices ......................................................................................................................................... 120
Ressourcen: SMB-Devices .................................................................................................................. 121
Seite 4 Beckhoff New Automation Technology CB3064-xxxx