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Beckhoff CB6467 Originalhandbuch Seite 4

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9.3.7
AMI Graphic Output Protocol Policy ................................................................................  50
9.3.8
PCI Subsystem Settings ..................................................................................................  51
9.3.9
USB Configuration ...........................................................................................................  53
9.3.10
NVMe Configuration ........................................................................................................  54
9.3.11
Power Controller Options.................................................................................................  55
9.3.12
SATA And RST Configuration .........................................................................................  56
9.3.13
AMT Configuration...........................................................................................................  59
9.3.14
TLs Auth Configuration ....................................................................................................  63
9.3.15
Network Stack Configuration ...........................................................................................  66
9.3.16
Network Stack Configuration enabled .............................................................................  66
9.3.17
Intel Rapid Storage Technology ......................................................................................  67
9.4
Chipset ............................................................................................................................................ 68
9.4.1
System Agent (SA) Configuration....................................................................................  69
9.4.2
PCH-IO Configuration......................................................................................................  71
9.5
Security............................................................................................................................................ 77
9.5.1
Secure Boot .....................................................................................................................  78
9.6
Boot ................................................................................................................................................. 93
9.6.1
Advanced Fixed Boot Order Parameters.........................................................................  94
9.7
Save & Exit ...................................................................................................................................... 95
10 Mechanische Zeichnungen..................................................................................................................... 96
10.1 Leiterplatte: Bohrungen ................................................................................................................... 96
10.2 Leiterplatte: Pin-1-Abstände ............................................................................................................ 97
10.3 Leiterplatte: Abmessungen .............................................................................................................. 98
11 Technische Daten .................................................................................................................................... 99
11.1 Elektrische Daten ............................................................................................................................ 99
11.2 Umgebungsbedingungen ................................................................................................................ 99
11.3 Thermische Spezifikationen .......................................................................................................... 100
12 Support und Service.............................................................................................................................. 101
12.1 Beckhoff-Support ........................................................................................................................... 101
12.2 Beckhoff-Service ........................................................................................................................... 101
12.3 Beckhoff-Firmenzentrale ............................................................................................................... 101
13 Anhang I: Post-Codes ........................................................................................................................... 102
14 Anhang II: Ressourcen.......................................................................................................................... 103
14.1 Interrupt ......................................................................................................................................... 103
14.2 PCI-Devices................................................................................................................................... 104
14.3 SMB-Devices ................................................................................................................................. 105
4
Version: 1.0
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