Beckhoff CB4058 Handbuch Seite 4

Inhalt
5.3.6 USB Configuration .............................................................................................................. 49
5.3.7 Super IO Configuration ....................................................................................................... 50
5.3.8 H/W Monitor ........................................................................................................................ 52
5.3.9 Serial Port Console Redirection ......................................................................................... 54
5.4 Chipset ........................................................................................................................................ 57
5.4.1 Host Bridge ......................................................................................................................... 58
5.4.2 South Bridge ....................................................................................................................... 61
5.5 Boot ............................................................................................................................................ 63
5.6 Security ....................................................................................................................................... 65
5.6.1 Secure Boot Policy ............................................................................................................. 66
5.6.2 Key Management................................................................................................................ 67
5.7 Save & Exit ................................................................................................................................. 69
5.8 BIOS-Update .............................................................................................................................. 70
6 Mechanische Zeichnung .................................................................................................................... 71
6.1 Leiterplatte: Bohrungen .............................................................................................................. 71
6.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 72
6.3 Leiterplatte: Heat Sink ................................................................................................................ 73
7 Technische Daten .............................................................................................................................. 74
7.1 Elektrische Daten ....................................................................................................................... 74
7.2 Umgebungsbedingungen ........................................................................................................... 74
7.3 Thermische Spezifikationen ....................................................................................................... 75
8 Support und Service .......................................................................................................................... 76
8.1 Beckhoff-Support ........................................................................................................................ 76
8.2 Beckhoff-Service ........................................................................................................................ 76
8.3 Beckhoff-Firmenzentrale ............................................................................................................ 76
I Anhang: Post-Codes .......................................................................................................................... 78
II Anhang: Ressourcen ......................................................................................................................... 80
IO-Bereich .............................................................................................................................................. 80
Memory-Bereich ..................................................................................................................................... 80
Interrupt .................................................................................................................................................. 80
PCI-Devices ........................................................................................................................................... 81
Ressourcen: SMB-Devices .................................................................................................................... 81
Seite 4 Beckhoff New Automation Technology CB4058