Toshiba V-854G Serviceanleitung Seite 53

NAME
1$S226
183184
MA111
GL451V
TLUG163
SE303AC
TLOINI3A
S1W8AG6O
MTZJ7.5B
SHAPE
3
3
1
2
2 1
SF
Cathode
Color (Green,Red)
fA
Cathode
3-6
o
5-1. Replacing Subminiature "CHIP" Parts
5-1-1. Required Tools:
1. Fine tipped, well insulated soldering "pencil", about
30 Watts.
"2. Tweezers.
3. Blower type hair dryer.
5-1-2. Soldering Cautions:
1. Do not apply heat for more than 3s.
2. Avoid using a rubbing stroke when soldering.
3. Discard removed chips; do no reuse them.
4, Supplementary cementing is not required.
5 . Use care not to scratch or otherwise damage the chips.
5-1-3. Removal (Resistors, Capacitors, etc.):
1. Melt the solder at one side.
Fig. 1
2. Grasp the part with tweezers and melt the solder at the
other side.
TWEEZERS
Fig. 2
3. Remove the part with a twisting motion.
ey
Fig. 3
5-1-4. Removal (Transistors, Diodes, etc.):
1. Melt the solder of one lead.
TWEEZERS
Fig. 4
2. Lift the side of that lead upward.
a
Fig. 5
3. Simultaneously heat solder the two remaining leads
and lift part to remove.
Fig. 6
5-1-5, Preheating (Except for semiconductors):
Immediately before installing new resistors or capacitors,
use a blower type hair dryer and preheat the part for about
two min. at approximately 150°C.
5-1-6. Replacement:
1. Presolder the contact points of the circuit pattern.
Fig. 7
2. Press the part downward with tweezers and apply the
soldering pencil as indicated in the figure.
TWEEZERS
Fig. 8