Siemens SIMATIC IFP1500 Produktinformation Seite 19

• The cross-section of an equipotential bonding conductor must be capable of handling the maximum equalizing current.
Equipotential bonding cables are required between two control cabinets with a minimum conductor cross-section of
16 mm².
• Use equipotential bonding conductors made of copper or galvanized steel. Establish a large surface contact between the
equipotential bonding conductors and the grounding/protective conductor and protect them from corrosion.
• Clamp the shield of the data cable from the device flush at the equipotential bonding rail using suitable cable clamps. The
equipotential bonding rail should be as close as possible to the device.
• Route the equipotential bonding conductor and data cables in parallel and with minimum clearance in between.
Note
Equipotential bonding cable
Cable shields are not suitable for equipotential bonding. Always use the prescribed equipotential bonding conductors for this.
An equipotential-bonding cable between control cabinets must have a minimum conductor cross-section of 16 mm². The
cable between the ground bar and device must have a minimum conductor cross-section of 4 mm
Wiring diagram
The following figure shows the connection of the functional ground for the equipotential bonding and similarly applies to all
IFP devices and the Transceiver Unit.
① Connection for functional ground
② Control cabinet
③ Equipotential bonding cable, 4 mm
④ Equipotential busbar for equipotential bonding cables, grounding connection and shield support in extended mode
⑤ Data cable to the Transceiver Unit in extended mode
⑥ Cable clip
⑦ Ground connection, 16 mm
SIMATIC Industrial Flat Panels V2 1500/1900 4:3/5:4
A5E50653860-AA, 01/2021
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