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1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
6
• Micro ATX Form Factor
• Solid Capacitor design
th
• Supports 8
Generation Intel® Core
1151)
• Digi Power design
• 10 Power Phase design
• Supports Intel® Turbo Boost 2.0 Technology
• Intel® H370
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• Supports DDR4 2666/2400/2133 non-ECC, un-buffered
memory
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
• 2 x PCI Express 3.0 x16 Slots (PCIE1/PCIE4: single at x16
(PCIE1); dual at x16 (PCIE1) / x4 (PCIE4))
* If PCIE2 is occupied, PCIE4 will downgrade to x2 mode.
* Supports NVMe SSD as boot disks
• 2 x PCI Express 3.0 x1 Slots (Flexible PCIe)
• Supports AMD Quad CrossFireX
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
and Intel® CNVi (Integrated WiFi/BT)
TM
Processors (Socket
TM
TM
and CrossFireX
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