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Inhaltsverzeichnis
  • Motherboard-Layout
  • Inhaltsverzeichnis
  • No. Description
    • Package Contents
    • Chassis Intrusion and Speaker Header (SPK_CI1)
    • Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
    • CPU Fan Connector (CPU_FAN1)
    • TPM Header (TPMS1)
    • Installing the CPU
    • Clear CMOS Pad (CLRMOS1)
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  • DEUTSCH, seite 24
Version 1.0
Published February 2018
Copyright©2018 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identification or explanation and to the owners' benefit, without intent to
infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or fitness for a particular
purpose.
In no event shall ASRock, its directors, officers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of profits, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
The Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
"Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate"
ASRock Website: http://www.asrock.com
Inhaltsverzeichnis
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Inhaltszusammenfassung für ASROCK H310M-DGS

  • Seite 24: Technische Daten

    Technische Daten • Micro-ATX-Formfaktor Plattform • Feststoffkondensator-Design • Unterstützt Intel® Core Prozessor -Prozessoren (Sockel 1151) der 8 Generation • 5-Leistungsphasendesign • Unterstützt Intel® Turbo Boost 2.0-Technologie • Intel® H310 Chipsatz • Dualkanal-DDR4-Speichertechnologie Speicher • 2 x DDR4-DIMM-Steckplätze • Unterstützt ungepufferten DDR4-2666/2400/2133-Non-ECC- Speicher • Systemspeicher, max.
  • Seite 25: Anschluss

    H310M-DGS • Unterstützt HDCP mit DVI-D-Port • 7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec) Audio * Zur Konfiguration von 7.1-Kanal-HD-Audio müssen Sie ein HD- Frontblenden-Audiomodul nutzen und den Mehrkanalton über den Audiotreiber aktivieren. • Unterstützt Überspannungsschutz • ELNA-Audiokondensatoren • PCIE-x1-Gigabit-LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H • Unterstützt Wake-On-LAN...
  • Seite 26: Funktion

    * Der Gehäuse-/Wasserpumpenlüfter unterstützt einenWasserkühler- lüfter mit einer maximalen Lüfterleistung von 2A (24 W). * CHA_FAN1/WP können automatisch erkennen, ob ein 3- oder 4-poliger Lüfter verwendet wird. • 1 x 24-poliger ATX-Netzanschluss • 1 x 8-poliger 12-V-Netzanschluss • 1 x Audioanschluss an Frontblende • 1 x USB 2.0-Stiftleiste (unterstützt zwei USB 2.0-Ports) (unterstützt Schutz gegen elektrostatische Entladung) • 1 x USB 3.1 Gen1-Stiftleiste (unterstützt zwei USB 3.1 Gen1-...

Inhaltsverzeichnis