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Version 1.0
Published February 2018
Copyright©2018 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identification or explanation and to the owners' benefit, without intent to
infringe.
Disclaimer:
Specifications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or fitness for a particular
purpose.
In no event shall ASRock, its directors, officers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of profits, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
The Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
"Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate"
ASRock Website: http://www.asrock.com

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Inhaltsverzeichnis
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Inhaltszusammenfassung für ASROCK H310M-DGS

  • Seite 1 (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
  • Seite 2 You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard International call charges apply)
  • Seite 3: Motherboard-Layout

    H310M-DGS Motherboard Layout Front USB 3.0 PCI Express 3.0 CPU_FAN1 CHA_FAN1/WP ATX12V1 USB 3.1 Gen1 T: USB1 B: USB2 RoHS USB 2.0 Intel Top: T: USB3 RJ-45 B: USB4 H310 CMOS Battery HD_AUDIO1 PCIE1 CLRCMOS1 TPMS1 AUDIO CODEC BIOS PCIE2...
  • Seite 4: Inhaltsverzeichnis

    No. Description ATX 12V Power Connector (ATX12V1) CPU Fan Connector (CPU_FAN1) 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1) Chassis/Water Pump Fan Connector (CHA_FAN1/WP) ATX Power Connector (ATXPWR1) USB 3.1 Gen1 Header (USB3_3_4) USB 2.0 Header (USB_5_6) SATA3 Connector (SATA3_2) SATA3 Connector (SATA3_3) SATA3 Connector (SATA3_0) SATA3 Connector (SATA3_1)
  • Seite 5: No. Description

    H310M-DGS I/O Panel No. Description No. Description USB 2.0 Ports (USB12) USB 2.0 Ports (USB_34) LAN RJ-45 Port* USB 3.1 Gen1 Ports (USB3_12) Line In (Light Blue)** DVI-D Port Front Speaker (Lime)** PS/2 Keyboard/Mouse Port Microphone (Pink)** * There are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
  • Seite 6 ** To configure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi- channel audio feature through the audio driver. Please set Speaker Configuration to “7.1 Speaker”in the Realtek HD Audio Manager. Function of the Audio Ports in 7.1-channel Configuration: Port Function...
  • Seite 7: Package Contents

    If you require technical support related to this mother- board, please visit our website for specific information about the model you are using. You may find the latest VGA cards and CPU support list on ASRock’s website as well. ASRock website http://www.asrock.com.
  • Seite 8 1.2 Specifications • Micro ATX Form Factor Platform • Solid Capacitor design • Supports 8 Generation Intel® Core Processors (Socket 1151) • 5 Power Phase design • Supports Intel® Turbo Boost 2.0 Technology • Intel® H310 Chipset • Dual Channel DDR4 Memory Technology Memory • 2 x DDR4 DIMM Slots • Supports DDR4 2666/2400/2133 non-ECC, un-buffered...
  • Seite 9: Cpu Fan Connector (Cpu_Fan1)

    H310M-DGS • Supports HDCP with DVI-D Port • 7.1 CH HD Audio (Realtek ALC887 Audio Codec) Audio * To configure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
  • Seite 10 • CASE OPEN detection • Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore • Microsoft® Windows® 10 64-bit • FCC, CE Certifica- • ErP/EuP ready (ErP/EuP ready power supply is required) tions * For detailed product information, please visit our website: http://www.asrock.com...
  • Seite 11 H310M-DGS Please realize that there is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tools. Overclocking may affect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense.
  • Seite 12 Chapter 2 Installation This is a Micro ATX form factor motherboard. Before you install the motherboard, study the configuration of your chassis to ensure that the motherboard fits into it. Pre-installation Precautions Take note of the following precautions before you install motherboard components or change any motherboard settings.
  • Seite 13: Installing The Cpu

    H310M-DGS 2.1 Installing the CPU 1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to insert the CPU into the socket if above situation is found.
  • Seite 15 H310M-DGS Please save and replace the cover if the processor is removed. The cover must be placed if you wish to return the motherboard for after service.
  • Seite 16 2.2 Installing the CPU Fan and Heatsink...
  • Seite 17 H310M-DGS 2.3 Installing Memory Modules (DIMM) This motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots, and supports Dual Channel Memory Technology. 1. For dual channel configuration, you always need to install identical (the same brand, speed, size and chip-type) DDR4 DIMM pairs.
  • Seite 19 H310M-DGS 2.4 Expansion Slots (PCI Express Slots) There are 2 PCI Express slots on the motherboard. Before installing an expansion card, please make sure that the power supply is switched off or the power cord is unplugged. Please read the documentation of the expansion card and make necessary hardware settings for the card before you start the installation.
  • Seite 20 2.5 Onboard Headers and Connectors Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard. System Panel Header Connect the power (9-pin PANEL1) RESET#...
  • Seite 21 H310M-DGS Chassis Intrusion and Please connect the DUMMY SPEAKER Speaker Header chassis intrusion and the DUMMY DUMMY (7-pin SPK_CI1) SIGNAL chassis speaker to this (see p.1, No. 14) header. Serial ATA3 Connectors These four SATA3 (SATA3_0: connectors support SATA see p.1, No. 10)
  • Seite 22 Front Panel Audio Header This header is for OUT_RET OUT2_L J_SENSE (9-pin HD_AUDIO1) connecting audio devices MIC_RED OUT2_R (see p.1, No. 16) to the front audio panel. PRESENCE# MIC2_R MIC2_L 1. High Definition Audio supports Jack Sensing, but the panel wire on the chassis must support HDA to function correctly.
  • Seite 23: Clear Cmos Pad (Clrmos1)

    H310M-DGS ATX 12V Power This motherboard Connector provides an 8-pin ATX (8-pin ATX12V1) 12V power connector. To (see p.1, No. 1) use a 4-pin ATX power supply, please plug it along Pin 1 and Pin 5. TPM Header This connector supports Trusted...
  • Seite 24: Technische Daten

    Technische Daten • Micro-ATX-Formfaktor Plattform • Feststoffkondensator-Design • Unterstützt Intel® Core Prozessor -Prozessoren (Sockel 1151) der 8 Generation • 5-Leistungsphasendesign • Unterstützt Intel® Turbo Boost 2.0-Technologie • Intel® H310 Chipsatz • Dualkanal-DDR4-Speichertechnologie Speicher • 2 x DDR4-DIMM-Steckplätze • Unterstützt ungepufferten DDR4-2666/2400/2133-Non-ECC- Speicher • Systemspeicher, max.
  • Seite 25: Anschluss

    H310M-DGS • Unterstützt HDCP mit DVI-D-Port • 7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec) Audio * Zur Konfiguration von 7.1-Kanal-HD-Audio müssen Sie ein HD- Frontblenden-Audiomodul nutzen und den Mehrkanalton über den Audiotreiber aktivieren. • Unterstützt Überspannungsschutz • ELNA-Audiokondensatoren • PCIE-x1-Gigabit-LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H • Unterstützt Wake-On-LAN...
  • Seite 26: Funktion

    * Der Gehäuse-/Wasserpumpenlüfter unterstützt einenWasserkühler- lüfter mit einer maximalen Lüfterleistung von 2A (24 W). * CHA_FAN1/WP können automatisch erkennen, ob ein 3- oder 4-poliger Lüfter verwendet wird. • 1 x 24-poliger ATX-Netzanschluss • 1 x 8-poliger 12-V-Netzanschluss • 1 x Audioanschluss an Frontblende • 1 x USB 2.0-Stiftleiste (unterstützt zwei USB 2.0-Ports) (unterstützt Schutz gegen elektrostatische Entladung) • 1 x USB 3.1 Gen1-Stiftleiste (unterstützt zwei USB 3.1 Gen1-...
  • Seite 27 H310M-DGS Spécifications • Facteur de forme Micro ATX Plateforme • Conception à condensateurs solides • Prend en charge les processeurs 8 ème Processeur génération Intel® Core (socket 1151) • Alimentation à 5 phases • Prend en charge la technologie Intel® Turbo Boost 2.0 • Intel®...
  • Seite 28 • Prend en charge HDCP via ports DVI-D • Audio 7.1 CH HD (Codec audio Realtek ALC887) Audio *Pour configurer l’audio 7.1 CH HD, il est nécessaire d’utiliser un module audio HD pour panneau frontal et d’activer la fonction audio multicanal via le pilote audio. • Prend en charge la protection contre les surtensions • Capuchons ELNA Audio • PCIE x1 Gigabit LAN 10/100/1000 Mo/s...
  • Seite 29 H310M-DGS • 1 x connecteur d’alimentation 12 V 8 broches • 1 x connecteur audio panneau frontal • 1 x embase USB 2.0 (2 ports USB 2.0 pris en charge) (Protection contre les décharges électrostatiques) • 1 x embase USB 3.1 Gen1 (2 ports USB 3.1 Gen1 pris en charge) (Protection contre les décharges électrostatiques)
  • Seite 30 Specifiche • Fattore di forma Micro ATX Piattaforma • Design condensatore solido • Supporta processori 8 Generation Intel® Core (Socket 1151) • Potenza a 5 fasi • Supporta la tecnologia Intel® Turbo Boost 2.0 • Intel® H310 Chipset • Tecnologia memoria DDR4 Dual Channel Memoria • 2 x alloggi DIMM DDR4 • Supporto di memoria DDR4 2666/2400/2133 non-ECC, un-...
  • Seite 31 H310M-DGS • Supporto di HDCP con le porte DVI-D • Audio HD 7.1 CH (codec audio Realtek ALC887) Audio * Per configurare l’audio HD 7.1 canali, è necessario utilizzare un modulo pannello frontale audio HD ed attivare la funzione audio multicanale tramite il driver audio.
  • Seite 32 * La ventola ventola pompa dell’acqua supporta ventole di sistemi di raffreddamento ad acqua di potenza massima di 2A (24W). * CHA_FAN1/WP sono in grado di rilevare se è in uso una ventola a 3 pin o 4 a pin. • 1 x connettore alimentazione ATX 24 pin • 1 x connettore alimentazione 12 V 8-pin • 1 x connettore audio pannello frontale...
  • Seite 33 H310M-DGS Especificaciones • Factor de forma Micro ATX Plataforma • Diseño de condensador sólido • Compatible con la 8 generación de procesadores Intel® Core (Socket 1151) • Diseño de 5 fases de alimentación • Admite la tecnología Intel® Turbo Boost 2.0 • Intel®...
  • Seite 34 • Compatible con función HDCP con puertos DVI-D • 7.1 Audio CH HD (Códec de audio Realtek ALC887) Audio *Para configurar 7.1 Audio CH HD, deberá utilizar un módulo del panel frontal de audio HD y habilitar la característica de audio multicanal a través del controlador de audio.
  • Seite 35 H310M-DGS * CHA_FAN1/WP se pueden detectar automáticamente si se usa el ventilador de 3 o 4 pines. • 1 x conector de alimentación ATX de 24 contactos • 1 x conector de alimentación de 12V de 8 pines • 1 x Conector de audio en el panel frontal • 1 x base de conexiones USB 2.0 (admite 2 puertos USB 2.0).
  • Seite 36 Спецификация • Форм-фактор Micro ATX Платформа • Схема на основе твердотельных конденсаторов • Поддержка процессоров 8 го ЦП поколения Intel® Core (Socket 1151) • Система питания 5 • Поддерживается технология Intel® Turbo Boost 2.0 • Intel® H310 Чипсет • Двухканальная память DDR4 Память...
  • Seite 37 H310M-DGS • 7.1-канальный звук высокой четкости (аудиокодек Realtek Звук ALC887) *Для настройки 7.1-канального звук высокой четкости HD Audio используйте переднюю аудиопанель HD и активируйте функцию многоканального звука в аудиодрайвере. • Защита от перепадов напряжения в электрической сети • Конденсаторы для аудиосистем ELNA • PCIE x1 Gigabit LAN 10/100/1000 Мбит/с...
  • Seite 38 • 1 разъем питания АТХ, 24-контактный • 1 разъем питания 12 В, 8-контактный • 1 аудиоразъем на передней панели • 1 колодка USB 2.0 (2 порта USB 2.0 с защитой от электростатических разрядов) • 1 колодка USB 3.1 Gen1 (2 порта USB 3.1 Gen1) (с защитой от...
  • Seite 39: Especificações

    H310M-DGS Especificações • Micro ATX Form Factor Plataforma • Design de condensador sólido • Suporta 8 ª Geraão de Processadores Intel® Core (Soquete 1151) • Design com 5 fases de alimentação • Suporta a tecnologia Intel® Turbo Boost 2.0 • Intel® H310 Chipset • Tecnologia de memória DDR4 de dois canais...
  • Seite 40 • Suporta HDCP com Portas DVI-D • Áudio 7.1 CH HD com proteção de conteúdo (Codec de áudio Áudio Realtek ALC887) *Para configurar Áudio 7.1 CH HD, é necessário usar um módulo de áudio de painel frontal HD e habilitar o recurso de áudio multi- canal pelo driver de áudio.
  • Seite 41 H310M-DGS * O Ventilador de Chassi Ventilador da Bomba de Água suporta o ventilador de refrigerador a água de 2A máximo (24W) potência do ventilador. * CHA_FAN1/WP podem detectar automaticamente se ventoinha de 3 pinos ou 4 pinos está em uso.
  • Seite 42 Özellikler • Micro ATX Form Faktörü Platform • Yekpare Kapasitör tasarımı • 8. Nesil Intel® Core İşlemci İşlemcileri (Yuva 1151) destekler • 5 Güç Safhası tasarımı • Intel® Turbo Boost 2.0 Teknolojisini destekler • Intel® H310 Yonga kümesi • Çift Kanallı DDR4 Bellek Teknolojisi Bellek • 2 tane DDR4 DIMM Yuvası...
  • Seite 43: Arka Panel

    H310M-DGS • 7.1 CH HD Ses (Realtek ALC887 Ses Kodlayıcı) * 7.1 CH HD Ses yapılandırması için, bir HD ön panel ses modülünün kullanılması ve çok kanallı ses özelliğinin ses sürücüsü aracılığıyla etkinleştirilmesi gereklidir. • Aşırı Gerilim Korumasını destekler • ELNA Ses Kapakları...
  • Seite 44 • 1 tane USB 2.0 Bağlantısı (2 USB 2.0 bağlantı noktasını destekler) (ESD Korumasını destekler) • 1 tane USB 3.1 Gen1 Bağlantısı (2 USB 3.1 Gen1 bağlantı nok- tasını destekler) (ESD Korumasını destekler) • Çok dilli kullanıcı arayüzü desteğiyle AMI UEFI Legal BIOS BIOS Özelliği • ACPI 6.0 Uyumlu uyandırma olayları...
  • Seite 45 H310M-DGS 규격 • Micro ATX 폼 팩터 플랫폼 • 솔리드 콘덴서 구조 • 8 세대 Intel® Core 프로세서 지원 ( 소켓 1151) • 5 개 전원 위상 구조 • Intel® Turbo Boost 2.0 기술 지원 • Intel® H310 칩세트 • 듀얼 채널 DDR4 메모리 기술...
  • Seite 46 • 서비 보호 지원 • ELNA 오디오 캡 • PCIE 1 개 , Gigabit LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H • Wake-On-LAN 지원 • 번개 /ESD 보호 지원 • 절전형 이더넷 802.3az 지원 • PXE 지원 • PS/2 마우스 / 키보드 포트 1 개 후면...
  • Seite 47 H310M-DGS • USB 3.1 Gen1 헤더 1 개 (USB 3.1 Gen1 포트 2 개 지원 ) (ESD 보호 지원 ) • 다국어 GUI 지원을 제공하는 AMI UEFI 적합형 BIOS BIOS 기능 • ACPI 6.0 준수 웨이크 업 이벤트 • SMBIOS 2.7 지원...
  • Seite 48 仕様 • マイクロ ATX フォームファクター プラッ ト • 固体コンデンサ設計 フォーム • 第 8 世代 Intel® Core プロセッサーに対応 (ソケッ ト 1151) • 5 電源フェーズ設計 • Intel® ターボブースト 2.0 テク ノロジーをサポート チップセッ ト • Intel® H310 • デュアルチャンネル DDR4 メモリ機能 メモリ • 2 x DDR4 DIMM スロッ ト • DDR4 2666/2400/2133 ノン...
  • Seite 49 H310M-DGS • DVI-D ポートで HDCP に対応 • 7.1 CH HD オーディオ (Realtek ALC887 Audio Codec) オーディオ *7.1 CH HD オーディオを設定するためには、 HD フロントパ ネルのオーディオモジュールを使用し、 オーディオドライバを 通してマルチチャンネルオーディオ機能を有効にする必要が あります。 • サージ保護に対応 • ELNA 製オーディオコンデンサ • PCIE x1 ギガビッ ト LAN 10/100/1000 Mb/ 秒...
  • Seite 50 * シャーシ / ウォーターポンプファンは最大 2A (24W) の出力の ウォータークーラーに対応します。 * CHA_FAN1/WP は 3 ピンまたは 4 ピンファンが使用されてい るかどうかを自動検出できます。 • 1 x 24 ピン ATX 電源コネクタ • 1 x 8 ピン 12V 電源コネクタ • 1 x 前面パネルオーディオコネクタ • 1 x USB 2.0 ヘッダー (2 つの USB 2.0 ポートに対応) ) ( 静電 気放電...
  • Seite 51 H310M-DGS 规格 • Micro ATX 规格尺寸 平台 • 稳固的电容器设计 • 支持第 8 代 Intel® Core 处理器(插座 1151) • 5 电源相设计 • 支持 Intel® Turbo Boost 2.0 技术 • Intel® H310 芯片集 • 双通道 DDR4 内存技术 内存 • 2 x DDR4 DIMM 槽...
  • Seite 52 • 7.1 CH 高清音频 (Realtek ALC887 音频编解码器 ) 音频 * 要配置 7.1 CH 高清音频,需要使用高清前面板模块和通过 音频驱动程序启用多通道音频功能。 • 支持电涌保护 • ELNA 音频电容 • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H • 支持 Wake-On-LAN(网上唤醒) • 支持雷电 / ESD 保护 • 支持高能效以太网...
  • Seite 53 H310M-DGS • AMI UEFI Legal BIOS,支持多语言 GUI BIOS • ACPI 6.0 兼容唤醒事件 功能特点 • SMBIOS 2.7 支持 • DRAM, PCH 1.05V 电压多次调整(Voltage Multi-adjust- ment) • 温度感测:CPU、机箱 / 水泵风扇 硬件监控 • 风扇转速计:CPU、机箱 / 水泵风扇 • 静音风扇(根据 CPU 温度自动调整机箱风扇速度): CPU、机箱 / 水泵风扇...
  • Seite 54 电子信息产品污染控制标示 依据中国发布的「电子信息产品污染控制管理办法」及 SJ/T 11364-2006「电子 信息产品污染控制标示要求」,电子信息产品应进行标示,藉以向消费者揭露 产品中含有的有毒有害物质或元素不致发生外泄或突变从而对环境造成污染或 对人身、财产造成严重损害的期限。依上述规定,您可于本产品之印刷电路板 上看见图一之标示。图一中之数字为产品之环保使用期限。由此可知此主板之 环保使用期限为 10 年。 图一 有毒有害物质或元素的名称及含量说明 若您欲了解此产品的有毒有害物质或元素的名称及含量说明,请参照以下表格 及说明。 有害物质或元素 部件名称 铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr(VI)) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 印刷电路板 及电子组件 外部信号连 接头及线材 O: 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006 标准规定 的限量要求以下。 X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准 规定的限量要求,然该部件仍符合欧盟指令...
  • Seite 55 H310M-DGS 規格 • Micro ATX 尺寸 平台 • 固態電容設計 • 支援第 8 代 Intel® Core 處理器 (Socket 1151) • 5 電源相位設計 • 支援 Intel® Turbo Boost 2.0 技術 • Intel® H310 晶片組 • 雙通道 DDR4 記憶體技術 記憶體 • 2 x DDR4 DIMM 插槽...
  • Seite 56 • 7.1 CH HD 音訊 (Realtek ALC887 音訊轉碼器 ) 音訊 * 若要設定 7.1 CH HD 音訊,必須使用 HD 前面板音訊模組, 並透過音訊驅動程式啟用多聲道音訊功能。 • 支援突波保護 • ELNA 音響級電容 • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H • 支援網路喚醒 • 支援雷擊/靜電保護 • 支援...
  • Seite 57 H310M-DGS • AMI UEFI Legal BIOS 含多語 GUI 支援 BIOS 功能 • ACPI 6.0 符合喚醒自動開機 • 支援 SMBIOS 2.7 • DRAM、PCH 1.05V 電壓多重調整 • 溫度感應: CPU、機殼/水冷幫浦風扇 硬體監視器 • 風扇轉速計: CPU、機殼/水冷幫浦風扇 • 靜音風扇(依 CPU 溫度自動調整機殼風扇速度): CPU、機殼/水冷幫浦風扇 • 風扇多重速度控制: CPU、機殼/水冷幫浦風扇 • 機殼開啟偵測...
  • Seite 58 Spesifikasi • Bentuk dan Ukuran Micro ATX Platform • Desain Kapasitor Solid • Mendukung Prosesor Generasi ke-8 Intel® Core (Soket 1151) • Desain 5 Fase Daya • Mendukung Teknologi Intel® Turbo Boost 2.0 • Intel® H310 Chipset • Teknologi Memori DDR4 Dua Saluran Memori • 2 x Slot DIMM DDR4 • Mendukung DDR4 2666/2400/2133 non-ECC, memori tanpa...
  • Seite 59 H310M-DGS • Mendukung HDCP dengan port DVI-D • Audio HD 7.1 CH (Realtek ALC887 Audio Codec) Audio * Untuk mengkonfigurasi Audio HD 7.1 CH, modul audio panel depan HD harus digunakan dan fitur audio multisaluran harus diaktifkan melalui driver audio.
  • Seite 60 * Sasis Opsional/Kipas Pompa Air mendukung kipas berpendingin air dengan daya kipas maksimum 1,5A (18W). * CHA_FAN1/WP dapat mendeteksi otomatis jika kipas 3-pin atau 4-pin sedang digunakan. • 1 x Konektor Daya ATX 24 pin • 1 x Konektor Daya 8 pin 12V • 1 x Konektor Audio Panel Depan • 1 x Header USB 2.0 (Mendukung 2 port USB 2.0) (Mendukung Perlindungan dari ESD)
  • Seite 61 H310M-DGS Specyfikacje • Współczynnik kształtu Micro ATX Platforma • Konstrukcja kondensatorami stałymi • Obsługa 8 generacji procesorów Intel® Core (Socket 1151) • Sekcja zasilania 5 Power Phase Design • Obsługa technologii Intel® Turbo Boost 2.0 • Intel® H310 Chipset • Technologia pamięci Dual Channel DDR4 Pamięć...
  • Seite 62 • Obsługa HDCP z portem DVI-D • Dźwięk HD 7.1 CH (kodek audio Realtek ALC887) Audio * Aby skonfigurować dźwięk 7.1 CH HD wymagane jest użycie modułu panelu czołowego HD i włączenie funkcji dźwięku wielokanałowego za pośrednictwem sterownika audio. • Obsługa zabezpieczenia przed przepięciami • Nasadki audio ELNA • 1 x PCIE Gigabit LAN 10/100/1000 Mb/s • 1 x Realtek RTL8111H...
  • Seite 63 H310M-DGS • 1 x 24 pinowe złącze zasilania ATX • 1 x 8 pinowe złącze zasilania 12 V • 1 x złącze audio na panelu przednim • 1 x złącza główkowe USB 2.0 (obsługuje 2 porty USB 2.0) (Obsługa zabezpieczenia ESD) • 1 x porty główkowe USB 3.1 Gen1 (obsługa 2 portów USB 3.1...
  • Seite 64: Contact Information

    Contact Information If you need to contact ASRock or want to know more about ASRock, you’re welcome to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer for further information. For technical questions, please submit a support request form at https://event.asrock.com/tsd.asp...
  • Seite 65: Declaration Of Conformity

    DECLARATION OF CONFORMITY Per FCC Part 2 Section 2.1077(a) ASRock Incorporation Responsible Party Name: 13848 Magnolia Ave, Chino, CA91710 Address: Phone/Fax No: +1-909-590-8308/+1-909-590-1026 hereby declares that the product Product Name : Motherboard H310M-DGS Model Number : Conforms to the following specifications:...
  • Seite 66: Eu Declaration Of Conformity

    EU Declaration of Conformity For the following equipment: Motherboard (Product Name) H310M-DGS / ASRock (Model Designation / Trade Name) ASRock Incorporation (Manufacturer Name) 2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.) (Manufacturer Address) EMC —Directive 2014/30/EU (from April 20th, 2016) ☐...

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