ASROCK H55M-LE Handbuch Seite 18

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Infrared Module Header
(5-pin IR1)
(see p.2 No. 21)
Chassis Intrusion Header
(2-pin CI1)
(see p.2 No. 22)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.2 No. 28)
1. High Definition Audio supports Jack Sensing, but the panel wire on
the chassis must support HDA to function correctly. Please follow the
instruction in our manual and chassis manual to install your system.
2. If you use AC'97 audio panel, please install it to the front panel audio
header as below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_RET and OUT_RET are for HD audio panel only. You don't
need to connect them for AC'97 audio panel.
E. Enter BIOS Setup Utility. Enter Advanced Settings, and then select
Chipset Configuration. Set the Front Panel Control option from
[Auto] to [Enabled].
System Panel Header
(9-pin PANEL1)
(see p.2 No. 15)
Chassis Speaker Header
(4-pin SPEAKER 1)
(see p.2 No. 14)
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This header supports an optional
wireless transmitting and
receiving infrared module.
This motherboard supports
CASE OPEN detection feature
that detects if the chassis cover
has been removed. This feature
requires a chassis with chassis
intrusion detection design.
This is an interface for front
panel audio cable that allows
convenient connection and
control of audio devices.
This header accommodates
several system front panel
functions.
Please connect the chassis
speaker to this header.
ASRock H55M-LE Motherboard