ASROCK H110M Combo-G Bedienungsanleitung Seite 8

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1.2 Speciications
• Micro ATX Form Factor
Platform
• Solid Capacitor design
• Supports 6
CPU
Celeron® Processors (Socket 1151)
• Digi Power design
• 6 Power Phase design
• Supports Intel® Turbo Boost 2.0 Technology
• Intel® H110
Chipset
• Dual Channel DDR4/DDR3/DDR3L Memory Technology
Memory
• 2 x DDR4 DIMM Slots
• Supports DDR4 2133 non-ECC, un-bufered memory
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Proile (XMP) 2.0
• 15μ Gold Contact in DDR4 DIMM Slots
• 2 x DDR3/DDR3L DIMM Slots
• Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-bufered memory
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Proile (XMP) 1.3 / 1.2
* DDR4 and DDR3/DDR3L memory can not be used
simultaneously.
• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
Expansion
• 1 x PCI Express 2.0 x16 Slot (PCIE3: x4 mode)
Slot
• 1 x PCI Express 2.0 x1 Slot
• Supports AMD Quad CrossFireX
• 15μ Gold Contact in VGA PCIe Slot (PCIE1)
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