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Version 1.0
Published July 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identiication or explanation and to the owners' beneit, without intent to
infringe.
Disclaimer:
Speciications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or itness for a particular
purpose.
In no event shall ASRock, its directors, oicers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of proits, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
his device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
he Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
"Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate"
ASRock Website: http://www.asrock.com
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Verwandte Anleitungen für ASROCK H110M-DVS /D3
Inhaltszusammenfassung für ASROCK H110M-DVS /D3
- Seite 1 (including damages for loss of proits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
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Seite 2: Motherboard-Layout
H110M-DVS/D3 Motherboard Layout CPU_FAN1 ATX12V1 USB 2.0 T: USB2 B: USB3 USB 2.0 Top: T: USB0 RJ-45 Front USB 3.0 B: USB1 CMOS Battery CHA_FAN1 H110M-DVS/D3 HD_AUDIO1 PCIE1 PCI Express 3.0 RoHS PCIE2 Intel H110 PCIE3 128Mb Audio BIOS CODEC PANEL1 PLED PWRBTN USB4_5... - Seite 3 No. Description ATX 12V Power Connector (ATX12V1) CPU Fan Connector (CPU_FAN1) 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1) ATX Power Connector (ATXPWR1) USB 3.0 Header (USB3_4_5) SATA3 Connector (SATA3_2) SATA3 Connector (SATA3_3) SATA3 Connector (SATA3_1) SATA3 Connector (SATA3_0) Clear CMOS Jumper (CLRMOS1) System Panel Header (PANEL1) USB 2.0 Header (USB4_5) Chassis Intrusion and Speaker Header (SPK_CI1)
- Seite 4 H110M-DVS/D3 I/O Panel No. Description No. Description PS/2 Mouse/Keyboard Port Microphone (Pink)** D-Sub Port (VGA1) USB 2.0 Ports (USB01) LAN RJ-45 Port* USB 2.0 Ports (USB_23) Line In (Light Blue)** DVI-D Port Front Speaker (Lime)** USB 3.0 Ports (USB3_01) * here are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications. ACT/LINK LED SPEED LED LAN Port...
- Seite 5 ** To conigure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi- channel audio feature through the audio driver. Please set Speaker Coniguration to “7.1 Speaker”in the Realtek HD Audio Manager. Function of the Audio Ports in 7.1-channel Coniguration: Port Function...
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Seite 6: Package Contents
If you require technical support related to this mother- board, please visit our website for speciic information about the model you are using. You may ind the latest VGA cards and CPU support list on ASRock’s website as well. ASRock website http://www.asrock.com. - Seite 7 1.2 Speciications • Micro ATX Form Factor Platform • Solid Capacitor design • High Density Glass Fabric PCB • Supports 6 Generation Intel® Core i7/i5/i3/Pentium®/ Celeron® Processors (Socket 1151) • Supports Intel® Turbo Boost 2.0 Technology • Intel® H110 Chipset • Dual Channel DDR3/DDR3L Memory Technology Memory • 2 x DDR3/DDR3L DIMM Slots...
- Seite 8 • 1 x PS/2 Mouse/Keyboard Port Rear Panel • 1 x D-Sub Port • 1 x DVI-D Port • 4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full Spike Protection)) • 2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full Spike Protection)) • 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED...
- Seite 9 * To install Windows® 7 OS, a modiied installation disk with xHCI drivers packed into the ISO ile is required. Please refer to page 62 for more detailed instructions. * For the updated Windows® 10 driver, please visit ASRock’s website for details: http://www.asrock.com...
- Seite 10 • ErP/EuP ready (ErP/EuP ready power supply is required) tions * For detailed product information, please visit our website: http://www.asrock.com Please realize that there is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tools.
- Seite 11 1.3 Jumpers Setup he illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is “Open”. he illustration shows a 3-pin jumper whose pin1 and pin2 are “Short” when a jumper cap is placed on these 2 pins.
- Seite 12 H110M-DVS/D3 1.4 Onboard Headers and Connectors Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard. System Panel Header Connect the power PLED+ PLED-...
- Seite 13 Chassis Intrusion and Please connect the SPEAKER DUMMY Speaker Header chassis intrusion and the DUMMY (7-pin SPK_CI1) chassis speaker to this (see p.1, No. 13) header. SIGNAL DUMMY Serial ATA3 Connectors hese four SATA3 (SATA3_0) connectors support SATA (see p.1, No. 9) data cables for internal (SATA3_1) storage devices with up to...
- Seite 14 H110M-DVS/D3 Front Panel Audio Header his header is for OUT_RET OUT2_L (9-pin HD_AUDIO1) connecting audio devices J_SENSE MIC_RET OUT2_R (see p.1, No. 17) to the front audio panel. PRESENCE# MIC2_R GN D MIC2_L 1. High Deinition Audio supports Jack Sensing, but the panel wire on the chassis must sup- port HDA to function correctly.
- Seite 15 ATX Power Connector his motherboard pro- (24-pin ATXPWR1) vides a 24-pin ATX power (see p.1, No. 4) connector. To use a 20-pin ATX power supply, please plug it along Pin 1 and Pin ATX 12V Power his motherboard pro- Connector vides a 4-pin ATX 12V (4-pin ATX12V1) power connector.
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Seite 16: Technische Daten
H110M-DVS/D3 Technische Daten • Micro-ATX-Formfaktor Plattform • Feststokondensator-Design • Leiterplatte mit hochdichtem Glasgewebe • Unterstützt die Prozessoren Intel® Core Prozessor i7/i5/i3/Pentium®/ Celeron® der 6. Generation (Sockel 1151) • Unterstützt Intel® Turbo Boost 2.0-Technologie • Intel® H110 Chipsatz • Dualkanal-DDR3/DDR3L-Speichertechnologie Speicher • 2 x DDR3/DDR3L-DIMM-Steckplätze • Unterstützt DDR3/DDR3L 1600/1333/1066 non-ECC, ungepuferter Speicher... - Seite 17 • 7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec) Audio *Zur Koniguration von 7.1-Kanal-HD-Audio müssen Sie ein HD-Frontblenden-Audiomodul nutzen und den Mehrkanalton über den Audiotreiber aktivieren. • Unterstützt Überspannungsschutz (ASRock Full Spike Pro- tection) • ELNA-Audiokondensatoren • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • Realtek RTL8111E • Unterstützt Wake-On-LAN...
- Seite 18 • 1 x 4-poliger 12-V-Netzanschluss • 1 x Audioanschluss an Frontblende • 1 x USB 2.0-Stitleiste (unterstützt 2 USB 2.0-Ports) (unter- stützt Schutz gegen elektrostatische Entladung (ASRock Full Spike Protection)) • 1 x USB 3.0-Stitleiste (unterstützt 2 USB 3.0-Ports) (unter- stützt Schutz gegen elektrostatische Entladung (ASRock Full...
- Seite 19 • ErP/EuP ready (ErP/EuP ready-Netzteil erforderlich) zierungen * Detaillierte Produktinformationen inden Sie auf unserer Webseite: http://www.asrock.com Bitte beachten Sie, dass mit einer Übertaktung, zu der die Anpassung von BIOS-Einstellungen, die Anwendung der Untied Overclocking Technology oder die Nutzung von Übertaktung- swerkzeugen von Drittanbietern zählen, bestimmte Risiken verbunden sind.
- Seite 20 H110M-DVS/D3 Spéciications • Facteur de forme Micro ATX Plateforme • Conception à condensateurs solides • PCB en tissu de verre haute densité • Prend en charge les processeurs 6 Processeur génération Intel® Core i5/i3/Pentium®/Celeron® (Socket 1151) • Prend en charge la technologie Intel® Turbo Boost 2.0 • Intel®...
- Seite 21 • 1 x port DVI-D arrière • 4 x ports USB 2.0 (Protection contre les décharges électrosta- tiques (Protection complète contre les pics ASRock)) • 2 x ports USB 3.0 (Protection contre les décharges électrosta- tiques (Protection complète contre les pics ASRock)) • 1 x port RJ-45 LAN avec LED (LED ACT/LIEN et LED...
- Seite 22 • 1 x embase USB 2.0 (2 ports USB 2.0 pris en charge) (Protection contre les décharges électrostatiques (Protection complète contre les pics ASRock)) • 1 x embase USB 3.0 (2 ports USB 3.0 pris en charge) (Protection contre les décharges électrostatiques (Protection complète contre les pics ASRock))
- Seite 23 Certiications • ErP/EuP Ready (alimentation ErP/EuP ready requise) * pour des informations détaillées de nos produits, veuillez visiter notre site : http://www.asrock.com Il est important de signaler que l’ o vercloking présente certains risques, incluant des modiica- tions du BIOS, l’ a pplication d’une technologie d’ o verclocking déliée et l’utilisation d’ o utils d’...
- Seite 24 H110M-DVS/D3 Speciiche • Fattore di forma Micro ATX Piattaforma • Design condensatore solido • PBC di ibra di vetro ad alta densità • Supporta processori 6 Generation Intel® Core i7/i5/i3/ Pentium®/Celeron® (Socket 1151) • Supporta la tecnologia Intel® Turbo Boost 2.0 • Intel®...
- Seite 25 • PCIE x 1 LAN Gigabit 10/100/1000 Mb/s • Realtek RTL8111E • Supporta Wake-On-LAN • Supporto la protezione da fulmini/scariche elettrostatiche (ESD) (protezione completa ASRock dai picchi di corrente) • Supporta il rilevamento cavo LAN • Supporta Energy Eicient Ethernet 802.3az • Supporta PXE • 1 x porta mouse/tastiera PS/2...
- Seite 26 • 1 x Collettore USB 2.0 (supporta 2 porte USB 2.0) (supporto protezione da scariche elettrostatiche (ESD) (protezione completa ASRock dai picchi di corrente)) • 1 x Collettore USB 3.0 (supporta 2 porte USB 3.0) (supporto protezione da scariche elettrostatiche (ESD) (protezione completa ASRock dai picchi di corrente)) • AMI UEFI Legal BIOS 128Mb con interfaccia di supporto...
- Seite 27 ISO. Fare riferi- Fare riferi- mento a pagina 62 per altre istruzioni dettagliate. * Per il driver aggiornato di Windows® 10, visitare il sito ASRock all'indirizzo: http://www.asrock.com • FCC, CE, WHQL Certiica- • ErP/EuP Ready (è...
- Seite 28 H110M-DVS/D3 Especiicaciones • Factor de forma Micro ATX Plataforma • Diseño de condensador sólido • PCB de ibra de vidrio de alta densidad • Admite la familia de procesadores Intel® Core i7/i5/i3/ Pentium®/Celeron® (zócalo 1151) de la 6ª generación • Compatible con la tecnología de Intel® Turbo Boost 2.0 • Intel®...
- Seite 29 *Para conigurar 7.1 Audio CH HD, deberá utilizar un módulo del panel frontal de audio HD y habilitar la característica de audio mul- ticanal a través del controlador de audio. • Compatible con protección por sobretensión (protección ASRock Full Spike) • Tapas de audio ELNA • 1 LAN Gigabit PCIE 10/100/1000 Mb/s...
- Seite 30 • 1 Conector de audio del panel frontal • 1 cabezal USB 2.0 (compatible con 2 puertos USB 2.0) (compatible con protección contra electricidad estática (protección ASRock Full Spike)) • 1 cabezal USB 3.0 (compatible con 2 puertos USB 3.0) (compatible con protección contra electricidad estática (protección ASRock...
- Seite 31 ErP/EuP) * Para obtener más información acerca del producto, visite nuestro sitio web: http://www.asrock.com Tenga en cuenta que existen ciertos riesgos relacionados con el overclocking (sobreaceleración), incluyendo el ajuste de la coniguración del BIOS, aplicando la Tecnología overcloking no vincu- lada o utilizando las herramientas de overclocking de tercera parte.
- Seite 32 H110M-DVS/D3 Спецификация • Форм-фактор Micro ATX Платформа • Схема на основе твердотельных конденсаторов • Печатная плата высокой плотности на основе стеклоткани • Поддержка процессоров 6- го Процессор поколения Intel® Core i7/i5/ i3/Pentium®/Celeron® (Socket 1151) • Поддержка технологии Intel® Turbo Boost 2.0 • Intel®...
- Seite 33 *Для настройки 7.1-канального звук высокой четкости HD Audio используйте переднюю аудиопанель HD и активируйте функцию многоканального звука в аудиодрайвере. • Защита от перенапряжения (ASRock Full Spike Protection) • Конденсаторы для аудиосистем ELNA • PCIE x1 Gigabit LAN 10/100/1000 Мб/с • Realtek RTL8111E • Поддержка...
- Seite 34 • 1 x аудиоразъем на передней панели • 1 x Колодка USB 2.0 (до 2 портов USB 2.0) с защитой от электростатического напряжения (ASRock Full Spike Pro- tection) • 1 x Колодка USB 3.0 (до 2 портов USB 3.0) с защитой от...
- Seite 35 установочный диск с драйверами xHCI, упакованными в файл ISO. Более подробные инструкции представлены на стр. 62. * Подробные сведения об обновлении драйвера Windows® 10 представлены на веб-сайте ASRock: http://www.asrock.com • FCC, CE, WHQL Сертификация • Совместимость с ErP/EuP (необходим блок питания, соответствующий...
- Seite 36 H110M-DVS/D3 Especiicações • Micro ATX Form Factor Plataforma • Design de condensador sólido • Tecido de Vidro de Alta densidade PCB • Supports Processadores Intel® 6 ª Geração Core i7/i5/i3/ Pentium®/Celeron® (Soquete 1151) • Suporta a tecnologia Intel® Turbo Boost 2.0 • Intel®...
- Seite 37 • LAN Gigabit 10/100/1000 Mb/s PCIE x1 • Realtek RTL8111E • Suporta Wake-On-LAN • Suporta Proteção contra Relâmpago/EDS (Proteção Total Contra Picos ASRock) • Suporta Detecção de Cabo LAN • Suporta Energy Eicient Ethernet 802.3az • Suporta PXE • 1 x Porta PS/2 para mouse/teclado E/S do pai- • 1 x Porta D-Sub...
- Seite 38 • 1 x conector de áudio do painel frontal • 1 x Plataforma USB 2.0 (Suporta 2 portas USB 2.0) (Suporta Proteção ESD (Proteção Total Contra Picos ASRock)) • 1 x Plataforma USB 3.0 (Suporta 2 portas USB 3.0) (Suporta Proteção ESD (Proteção Total Contra Picos ASRock))
- Seite 39 ErP/EuP) * Para obter informações detalhadas sobre o produto, por favor, visite o nosso site: http://www.asrock.com Por favor, observe que existe um certo risco envolvendo overclocking, incluindo o ajuste das deinições na BIOS, a aplicação de tecnologia Untied Overclocking ou a utilização de ferra- mentas de overclocking de terceiros.
- Seite 40 H110M-DVS/D3 Özellikler • Micro ATX Form Faktörü Platform • Yekpare Kapasitör tasarımı • Yüksek Yoğunluklu Cam Elyaf PCB • 6. Nesil Intel® Core i7/i5/i3/Pentium®/Celeron® İşlemcileri destekler (Yuva 1151) • Intel® Turbo Boost 2.0 Teknolojisini destekler • Intel® H110 Yonga kümesi • Çit Kanallı...
- Seite 41 *7.1 CH HD Ses konigürasyonu için bir HD ön panel ses modülü kullanılmalı ve çok kanallı ses özelliği ses sürücüsüsü ile etkinleştirilmelidir. • Dalgalanma Koruması Destekler (ASRock Tam Ani Gerilim Koruması) • ELNA Ses Kapakları • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • Realtek RTL8111E...
- Seite 42 • 1 x 4 pim 12V Güç Bağlayıcısı • 1 x Ön Panel Ses Bağlayıcısı • 1 x USB 2.0 Bağlantısı (2 USB 2.0 bağlantı noktası destekler) (ESD Koruması Destekler (ASRock Tam Ani Gerilim Koruması)) • 1 x USB 3.0 Bağlantısı (2 USB 3.0 bağlantı noktası destekler) (ESD Koruması...
- Seite 43 • ErP/EuP için hazır (ErP/EuP için hazır güç beslemesi ger- eklidir) * Detaylı ürün bilgisi için, lütfen web sitemizi ziyaret edin: http://www.asrock.com Lütfen, BIOS ayarlarını düzenleme, Bağımsız Hız Aşırtma Teknolojinin uygulanması ya da üçüncü kişilerin hız aşırtma araçlarının kullanılması da dahil olmak üzere tüm hız aşırtma işlemlerinin belirli bir risk taşıdığını...
- Seite 44 H110M-DVS/D3 규격 • Micro ATX 폼 팩터 플랫폼 • 솔리드 콘덴서 구조 • 고밀도 유리 직물 PCB • 6 세대 Intel® Core i7/i5/i3/Pentium®/Celeron® 프로세서 ( 소 켓 1151) 지원 • Intel® Turbo Boost 2.0 기술 지원 • Intel® H110 칩세트 •...
- Seite 45 후면 패널 • D-Sub 포트 1 개 • DVI-D 포트 1 개 • USB 2.0 포트 4 개 (ESD 보호 지원 (ASRock 풀 스파이크 보 호 )) • USB 3.0 포트 2 개 (ESD 보호 지원 (ASRock 풀 스파이크 보...
- Seite 46 * 업데이트된 Windows® 10 드라이브에 대한 자세한 내용은 다 음의 ASRock 웹사이트를 참조하십시오 . http://www.asrock.com • FCC, CE, WHQL 인증 • ErP/EuP 사용 가능 (ErP/EuP 사용 가능 전원공급장치 필 요 ) * 자세한 제품 정보에 대해서는 당사 웹사이트를 참조하십시오 : http://www.asrock.com...
- Seite 47 BIOS 설정을 조정하거나 Untied Overclocking Technology 를 적용하거나 타업체의 오 버클로킹 도구를 사용하는 것을 포함하는 오버클로킹에는 어느 정도의 위험이 따른 다는 것을 유념하십시오 . 오버클로킹은 시스템 안정성에 영향을 주거나 심지어 시스 템의 구성 요소와 장치에 손상을 입힐 수도 있습니다 . 오버클로킹은 사용자 스스로 위험과...
- Seite 48 H110M-DVS/D3 仕様 • マイクロ ATX フォームファクター プラットフォーム • 固体コンデンサ設計 • 高密度ガラス繊維 PCB • 第 6 世代 Intel® Core i7/i5/i3/Pentium®/Celeron® プロセ ッサーに対応 （ソケッ ト 1151） • Intel® ターボブースト 2.0 テク ノロジーをサポート • Intel® H110 チップセット • デュアルチャンネル DDR3/DDR3L メモリテク ノロジー メモリ •...
- Seite 49 • 1 x PS/2 マウス / キーボードポート リアパネル I/O • 1 x D-Sub ポート • 1 x DVI-D ポート • 4 x USB 2.0 ポート （静電気放電 （ESD） 保護に対応 （ASRock 完全スパイク保護） ） • 2 x USB 3.0 ポート （静電気放電 （ESD） 保護に対応 （ASRock 完全スパイク保護） ）...
- Seite 50 • Microsot® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit * Windows® 7 OS をインストールするために、 xHCI ドライバが ISO ファイルに含まれる変更されたインストールディスクが必 要です。 詳しい説明については 62 ページを参照してく ださい。 * 更新された Windows® 10 ドライバについては、 ASRock のウェ ブサイ トで詳細をご確認く ださい : http://www.asrock.com...
- Seite 51 • FCC、 CE、 WHQL 認証 • ErP/EuP Ready （ ErP/EuP 対応電源供給装置が必要です） * 商品詳細については、 当社ウェブサイ トをご覧く ださい。 http://www.asrock.com BIOS 設定の調整、 アンタイ ドオーバークロックテク ノロジーの適用、 サードパーティの オーバークロックツールの使用などを含む、 オーバークロックには、 一定のリスクを伴い ますのでご注意く ださい。 オーバークロックするとシステムが不安定になったり、 システ ムのコンポーネントやデバイスが破損するこ とがあります。 ご自分の責任で行ってく だ さい。 弊社では、 オーバークロックによる破損の責任は負いかねますのでご了承く ださ い。...
- Seite 52 H110M-DVS/D3 规格 • Micro ATX 规格尺寸 平台 • 稳固的电容器设计 • 高密度防潮纤维电路板 • 支持第 6 代 Intel® Core i7/i5/i3/Pentium®/Celeron® 处理器 (Socket 1151) • 支持 Intel® Turbo Boost 2.0 技术 • Intel® H110 芯片集 • 双通道 DDR3/DDR3L 内存技术 内存 • 2 x DDR3/DDR3L DIMM 槽 •...
- Seite 53 • 7.1 CH 高清音频 (Realtek ALC887 音频编解码器 ) 音频 * 要配置 7.1 CH 高清音频，需要使用高清前面板模块和通过 音频驱动程序启用多通道音频功能。 • 支持电涌保护（华擎全防护） • ELNA 音频电容 • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • Realtek RTL8111E • 支持 Wake-On-LAN（网上唤醒） • 支持雷电 /ESD 保护（华擎全防护） • 支持 LAN 线缆检测 •...
- Seite 54 • Microsot® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit 操作系统 * 要安装 Windows® 7 OS，需要 xHCI 驱动程序已封装到 ISO 文件的经修改的安装盘。请参考第 62 页了解详情。 * 有关已更新的 Windows® 10 驱动程序，请访问华擎网站了 解详情 : http://www.asrock.com • FCC、CE、WHQL 认证 • ErP/EuP 支持（需要支持 ErP/EuP 的电源） * 有关详细产品信息，请访问我们的网站： http://www.asrock.com 须认识到超频会有一定风险，包括调整...
- Seite 55 电子信息产品污染控制标示 依据中国发布的「电子信息产品污染控制管理办法」及 SJ/T 11364-2006「电子 信息产品污染控制标示要求」，电子信息产品应进行标示，藉以向消费者揭露 产品中含有的有毒有害物质或元素不致发生外泄或突变从而对环境造成污染或 对人身、财产造成严重损害的期限。依上述规定，您可于本产品之印刷电路板 上看见图一之标示。图一中之数字为产品之环保使用期限。由此可知此主板之 环保使用期限为 10 年。 图一 有毒有害物质或元素的名称及含量说明 若您欲了解此产品的有毒有害物质或元素的名称及含量说明，请参照以下表格 及说明。 有害物质或元素 部件名称 铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr(VI)) 多溴联苯 (PBB) 多溴二苯醚 (PBDE) 印刷电路板 及电子组件 外部信号连 接头及线材 O: 表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006 标准规定 的限量要求以下。 X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006 标准 规定的限量要求，然该部件仍符合欧盟指令...
- Seite 56 H110M-DVS/D3 規格 • Micro ATX 尺寸 平台 • 固態電容設計 • 高密度防潮纖維電路板 • 支援第 6 代 Intel® Core i7/i5/i3/Pentium®/Celeron® 處理器 （插座 1151） • 支援 Intel® Turbo Boost 2.0 技術 • Intel® H110 晶片組 • 雙通道 DDR3/DDR3L 記憶體技術 記憶體 • 2 x DDR3/DDR3L DIMM 插槽 •...
- Seite 57 • 7.1 CH HD 音訊 (Realtek ALC887 音訊轉碼器 ) 音訊 * 若要設定 7.1 CH HD 音訊，必須使用 HD 前面板音訊模組， 並透過音訊驅動程式啟用多聲道音訊功能。 • 支援突波保護（華擎全防護） • ELNA 音響級電容 • PCIE x1 Gigabit LAN 10/100/1000 Mb/s • Realtek RTL8111E • 支援網路喚醒 • 支援雷擊／靜電保護（華擎全防護） • 支援 LAN 纜線偵測 •...
- Seite 58 作業系統 64 位元 * 若要安裝 Windows® 7 作業系統，需要使用修改過的安裝光碟 （已將 xHCI 驅動程式封裝至 ISO 檔案）。如需詳細說明，請 查看第 62 頁。 * 關於最新 Windows® 10 驅動程式的詳細資訊，請瀏覽華擎網 站：http://www.asrock.com • FCC、CE、WHQL 認證 • ErP/EuP ready（須具備 ErP/EuP ready 電源供應器） * 如需產品詳細資訊，請上我們的網站： http://www.asrock.com 請務必理解，超頻可能產生某種程度的風險，其中包括調整 BIOS 中的設定、採用自 由超頻技術或使用協力廠商的超頻工具。超頻可能會影響您系統的穩定性，或者甚至 會對您系統的元件及裝置造成傷害。您應自行負擔超頻風險及成本。我們對於因超頻 所造成的可能損害概不負責。...
- Seite 59 Spesiikasi • Bentuk dan Ukuran Micro ATX Platform • Desain Kapasitor Solid • PCB Serat Kaca dengan Kerapatan Tinggi • Mendukung Prosesor i7/i5/i3/Pentium®/Celeron® (Soket 1151) Intel® Core Generasi ke-6 • Mendukung Teknologi Intel® Turbo Boost 2.0 • Intel® H110 Chipset • Teknologi Memori DDR3/DDR3L Kanal Ganda Memori • 2 x Slot DDR3/DDR3L DIMM...
- Seite 60 Panel I/O • 1 x Port D-Sub Belakang • 1 x Port DVI-D • 4 x Port USB 2.0 (Mendukung Perlindungan ESD (ASRock Full Spike Protection)) • 2 x Port USB 3.0 (Mendukung Perlindungan ESD (ASRock Full Spike Protection)) • 1 x Port LAN RJ-45 dengan LED (ACT/LINK LED dan SPEED LED) • Soket Audio HD: Saluran Masuk/Speaker Depan/Mikrofon...
- Seite 61 • Microsot® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-bit * Untuk menginstal OS Windows® 7, diperlukan disk instalan termodiikasi dengan driver xHCI dalam ile ISO. Untuk petunjuk lebih rinci, lihat halaman 62. * Untuk driver Windows® 10 terbaru, kunjungi situs web ASRock untuk informasi lebih lanjut: http://www.asrock.com...
- Seite 62 Sertiikasi • Siap untuk ErP/EuP (memerlukan catu daya untuk ErP/EuP) * Untuk informasi tentang produk rinci, kunjungi situs web kami: http://www.asrock.com Perlu diketahui, overclocking memiliki risiko tertentu, termasuk menyesuaikan pengaturan pada BIOS, menerapkan Teknologi Untied Overclocking, atau menggunakan alat overclocking pihak ketiga.
- Seite 63 Requirements • A Windows® 7 installation disk or USB drive • USB 3.0 drivers (included in the ASRock Support CD or website) • A Windows® PC • Win7 USB Patcher (included in the ASRock Support CD or website) Scenarios...
- Seite 64 Select the “Win7 Folder” from Step1 by clicking the red circle as shown as the picture below. Step 4 Select the “USB Driver Folder” by clicking the red circle as shown as the picture below. If you are using ASRock’s Support CD for the USB 3.0 driver, please select your CD-ROM.
- Seite 65 Step 5 Select where to save the ISO ile by pressing the red circle as shown as the picture below. Step 6 If you want to burn the patched image to a CD, please check “Burn Image” and select “Target Device to Burn”.
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Seite 66: Contact Information
Contact Information If you need to contact ASRock or want to know more about ASRock, you’re welcome to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer for further information. For technical questions, please submit a support request form at http://www.asrock.com/support/tsd.asp...