Specifications - ASROCK H55M/USB3 Handbuch

1.2 1.2 1.2

Specifications

Specifications Specifications
1.2 1.2 Specifications Specifications
Platform - Micro ATX Form Factor: 9.6-in x 8.8-in, 24.4 cm x 22.4 cm
- Solid Capacitor for CPU power
CPU - Supports Intel
Processors in LGA1156 Package
- 4 + 1 Power Phase Design
- Supports Intel
- Supports Hyper-Threading Technology (see CAUTION 2)
- Supports Untied Overclocking Technology (see CAUTION 3)
- Supports EM64T CPU
Chipset - Intel
Memory - Dual Channel DDR3 Memory Technology (see CAUTION 4)
- 2 x DDR3 DIMM slots
- Supports DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/
1333/1066 non-ECC, un-buffered memory
- Max. capacity of system memory: 8GB (see CAUTION 5)
- Supports Intel
(see CAUTION 6)
Expansion Slot - 1 x PCI Express 2.0 x16 slot (at x16 mode)
- 2 x PCI Express 2.0 x1 slots (2.5GT/s)
- 1 x PCI slot
Graphics * * Requires a Processor with Intel
- Intel
- Pixel Shader 4.0, DirectX 10
- Max. shared memory 1759MB (see CAUTION 7)
- Three VGA Output options: D-Sub, DVI-D and HDMI
(see CAUTION 8)
- Supports HDMI 1.3a Technology with max. resolution up to
1920x1200
- Supports DVI with max. resolution up to 1920x1200 @ 60Hz
- Supports D-Sub with max. resolution up to 2048x1536 @
75Hz
- Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI 1.3a
(Compliant HDMI monitor is required) (see CAUTION 9)
- Supports HDCP function with DVI and HDMI ports
- Supports Full HD 1080p Blu-ray (BD) / HD-DVD playback with
DVI and HDMI ports
ASRock H55M/USB3 Motherboard
® TM
Core i7 / i5 / i3 and Pentium
® Turbo Boost Technology (see CAUTION 1)
® H55
® Extreme Memory Profile (XMP)
®
HD Graphics
®
G6950
® Graphics Technology
5 5 5 5 5