ASROCK H670M-ITX/ax Bedienungsanleitung Seite 12

1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
8
• Mini-ITX Form Factor
• 8 Layer PCB
th
• Supports 12 Gen Intel® Core
• Digi Power design
• 8 Power Phase design
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® H670
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• Supports DDR4 non-ECC, un-buffered memory up to
5000+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 1 x PCIe Gen5x16 Slot*
* Supports PCIe riser cards to extend one x16 slot to two x8 slots
* Supports NVMe SSD as boot disks
• 1 x Vertical M.2 Socket (Key E), supports type 2230 WiFi/BT
PCIe WiFi module and Intel® CNVi (Integrated WiFi/BT)
* Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
e
• Intel® X Graphics Architecture (Gen 12)
• Dual graphics output: support HDMI and DisplayPort 1.4
ports by independent display controllers
• Supports HDMI 2.1 TMDS Compatible with max. resolution
up to 4K x 2K (4096x2160) @ 60Hz
TM
Processors (LGA1700)