Inhaltsverzeichnis
Werbung
DDR3-1333MHz
Anbieter
Artikelnummer
G.SKILL
F3-10600CL8D-2GBHK
G.SKILL
F3-10600CL9D-2GBPK
G.SKILL
F3-10666CL7T-3GBPK
G.SKILL
F3-10666CL9T-3GBNQ
G.SKILL
F3-10600CL7D-2GBPI
G.SKILL
F3-10600CL9D-2GBNQ
G.SkiLL
F3-10666CL8D-4GBHK
G.SKILL
F3-10666CL7T-6GBPK
G.SKILL
F3-10666CL9T-6GBNQ
GEIL
DDR3-1333 CL9-9-9-24
GEIL
GV34GB1333C7DC
GEIL
GG34GB1333C9DC
GEIL
DDR3-1333 CL9-9-9-24
Kingmax
FLFD45F-B8MH9 MAES
Kingmax
FLFE85F-B8MF9
Kingmax
FLFE85F-B8MH9 MEES
Kingston
KVR1333D3N9/1G
Kingston
KVR1333D3N9/2G
Micron
MT8JTF12864AY-1G4D1
Micron
MT8JTF12864AZ-1G4F1
Micron
MT9JSF 12872AZ-1G4F1
Micron
MT8JTF12864AY-1G4D1
Micron
MT12JSF25672AZ-1G4F1 2048MB
Micron
MT16JTF25664AY-1G1D1 2048MB
Micron
MT18JTF25664AZ-1G4F1 2048MB
Micron
MT16JTF25664AY-1G4D1 6144MB(Kit of 3 ) DS
OCZ
OCZ3X1333LV3GK(XMP)
OCZ
OCZ3G13334GK
OCZ
OCZ3P13334GK
OCZ
OCZ3G1333LV6GK
OCZ
OCZ3P1333LV6GK
OCZ
OCZ3X1333LV6GK(XMP)
SAMSUNG M378B2873DZ1-CH9
SAMSUNG M378B2873DZ1-CH9
SAMSUNG M378B2873EH1-CH9
SAMSUNG M391B2873DZ1-CH9
SAMSUNG M378B5673DZ1-CH9
SAMSUNG M378B5673EH1-CH9
SAMSUNG M391B5673DZ1-CH9
Super
W1333X2GB8
Talent
Transcend
TS128MLK64V3U
Transcend
TS128MLK72V3U
Transcend
TS256MLK64V3U
Transcend
TS256MLK64V3U
1-14
SS/
Größe
Marke
DS
1024MB
SS
G.SKILL Heat-Sink Package
1024MB
SS
G.SKILL Heat-Sink Package
3072MB(Kit of 3)
SS
N/A
3072MB(Kit of 3)
SS
N/A
1024MB
DS
G.SKILL Heat-Sink Package
1024MB
DS
G.SKILL Heat-Sink Package
4096MB(Kit of 2 ) DS
N/A
6144MB(Kit of 3 ) DS
N/A
6144MB(Kit of 3)
DS
N/A
1024MB
SS
N/A
2048MB
DS
N/A
4096MB(Kit of 2)
DS
GEIL
6144MB(Kit of 3 ) DS
N/A
1024MB
SS
Micron
2048MB
DS
Micron
2048MB
DS
Micron
1024MB
SS
Hynix
2048MB
DS
Qimonda IDSH1G-03A1F1C-13H
1024MB
SS
Micron
1024MB
SS
Micron
1024MB
SS
Micron
3072MB(Kit of 3)
SS
Micron
DS
Micron
DS
Micron
DS
Micron
Micron
3072MB(Kit of 3)
SS
N/A
4096MB(Kit of 2)
DS
N/A
4096MB(Kit of 2)
DS
N/A
6144MB(Kit of 3 ) DS
N/A
6144MB(Kit of 3 ) DS
N/A
6144MB(Kit of 3 ) DS
N/A
1024MB
SS
Samsung K4B1G0846D-HCH9
1024MB
SS
Samsung SEC 846 HCH9 K4B1G08460
1024MB
SS
Samsung SEC 913 HCH9 K4B1G0846E
1024MB
SS
Samsung K4B1G0846D-HCH9(ECC)
2048MB
DS
Samsung K4B1G0846D-HCH9
2048MB
DS
Samsung SEC 913 HCH9 K4B1G0846E
2048MB
DS
Samsung K4B1G0846D-HCH9(ECC)
1024MB
SS
N/A
1024MB
SS
N/A
1024MB
SS
N/A
2048MB
DS
Micron
2048MB
DS
N/A
(Fortsetzung auf der nächsten Seite)
Chip-Nr.
(BIOS)
Heat-Sink Package
7-7-7-18 1.5~1.6V
Heat-Sink Package
9-9-9-24 1.5~1.6V
Heat-Sink Package
8-8-8-21 1.5-1.6V
Heat-Sink Package
7-7-7-18 1.5~1.6V
Heat-Sink Package
9-9-9-24 1.5V~1.6V
Heat-Sink Package
Heat-Sink Package
7-7-7-24
GL1L128M88BA12N
9-9-9-24 1.3V(low
Heat-Sink Package
9CF22D9KPT
8HD22D9JNM
9GF27D9KPT
H5TQ1G83BFR
8LD22D9JNM
9FF22D9KPT
91F22D9KPT(ECC)
8XD22D9JNM
91F22D9KPT(ECC)
8LD22 D9JNM
9KF27D9KPT
8UD22D9JNM
Heat-Sink Package
Heat-Sink Package
Heat-Sink Package
7-7-7-20
Heat-Sink Package
9-9-9-20
Heat-Sink Package
7-7-7-20
Heat-Sink Package
8-8-8-20
Heat-Sink Package
SEC 813HCH9 K4B1G0846D
K4B1G0846D(ECC)
9GF27D9KPT
SEC816HCH9K4B1G0846D
Kapitel 1: Produkteinführung
DIMM
Takt
Unterstützung
DIMM
Spanng.
A*
B*
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
9
•
•
1.5V
•
•
•
•
voltage)
9
1.5V
•
•
•
•
•
•
•
•
9
1.5V
•
•
1.5V
•
•
•
•
9
•
•
9
•
•
9
•
•
9
•
•
•
•
9
•
•
9
•
•
1.6V
•
1.7V
•
•
1.8V
•
•
1.65V
•
•
1.65V
•
•
1.60V
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Werbung
Inhaltsverzeichnis
