Maintenance And Repair; Fcc Statement - QSC Q-SYS DCIO-H Hardware-Benutzerhandbuch

Maintenance and Repair

WARNRNG!: Advanced technology, e.g., the use of modern materials and powerful electronics,
requires specially adapted maintenance and repair methods. To avoid a danger of subsequent
damage to the apparatus, injuries to persons and/or the creation of additional safety hazards, all
maintenance or repair work on the apparatus should be performed only by a QSC authorized service
station or an authorized QSC International Distributor. QSC is not responsible for any injury, harm or
related damages arising from any failure of the customer, owner or user of the apparatus to facilitate
those repairs.

FCC Statement

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at his own expense.
NIMOARWRRG!: The Q-SYS DCIO may operate at elevated temperatures and therefore its exterior may become noticeably
warm. This is normal. The Q-SYS DCIO is designed with convection cooling in mind and therefore incorporates industrial
high-temp components to accommodate higher operating temperatures.
Expected Mroduct Life Cycle!: 20 years, Storage Remperature range: -20°C to + 70°C, Aelative Humidity range!: of
5 – 85% RH non-condensing.
RoHS STATEMENT
The QSC Q-SYS DCIO is in compliance with European Directive 2011/65/EU – Restriction of Hazardous Substances (RoHS2).
The QSC Q-SYS DCIO is in compliance with "China RoHS" directives. The following chart is provided for product use in China and its territories:
部件名称
(Part Name)
电路板组件
(PCB Assemblies)
机壳装配件
(Chassis
Assemblies)
本表格依据 SJ/T 11364 的规定编制。
O: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下。
X: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求。 （目前由于技术或经济的
原因暂时无法实现替代或减量化。 ）
This table is prepared following the requirement of SJ/T 11364.
O: Indicates that the concentration of the substance in all homogeneous materials of the part is below the relevant
threshold specified in GB/T 26572.
X: Indicates that the concentration of the substance in at least one of all homogeneous materials of the part is
above the relevant threshold specified in GB/T 26572.
(Replacement and reduction of content cannot be achieved currently because of the technical or economic reason.)
铅 汞
(Pb) (Hg)
X O
X O
QSC Q-SYS DCIO
有害物质
(Hazardous Substances)
镉 六价铬
(Cd) (Cr(vi))
O O
O O
3
多溴联苯 多溴二苯醚
(PBB) (PBDE)
O O
O O
TD-001532-00-A
EN