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ASROCK H510M-HDV/M.2 Bedienungsanleitung Seite 9

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1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
6
• Micro ATX Form Factor
• Solid Capacitor design
th
• Supports 10
Gen Intel® Core
TM
Intel® Core
Processors (LGA1200)
• 5 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® H510
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• Supports DDR4 3200(OC ) /2933/2800/2666/2400/2133 non-
ECC, un-buffered memory
th
TM
* 11
Gen Intel® Core
TM
Core
(i3), Pentium® and Celeron® support DDR4 up to 2666.
th
TM
* 10
Gen Intel® Core
TM
Core
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
11
th
Gen Intel® Core
TM
Processors
• 1 x PCI Express 4.0 x16 Slot*
10
th
Gen Intel® Core
TM
Processors
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 1 x PCI Express 3.0 x1 Slot
TM
Processors and 11
(i9/i7/i5) support DDR4 up to 3200(OC ) ;
(i9/i7) support DDR4 up to 2933;
th
Gen

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