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Version 1.3
Reflow Soldering Profile
Reflow-Lötprofil
Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01
300
˚C
T
250
200
150
100
50
0
0
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*
25 °C to 150 °C
Time t
S
T
to T
Smin
Smax
Ramp-up rate to peak*
T
to T
Smax
P
Liquidus temperature
Time above liquidus temperature
Peak temperature
Time within 5 °C of the specified peak
temperature T
- 5 K
P
Ramp-down rate*
T
to 100 °C
P
Time
25 °C to T
P
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2016-07-15
240 ˚C
217 ˚C
t
25 ˚C
50
100
Symbol
Symbol
)
t
S
)
T
L
t
L
T
P
t
P
S
150
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation
60
10
19
GW JDSRS1.EC
T
p
t
P
t
L
200
250
Maximum
2
3
100
120
2
3
217
80
100
245
260
20
30
3
6
480
OHA04525
245 ˚C
s
300
t
OHA04612
Unit
Einheit
K/s
s
K/s
°C
s
°C
s
K/s
s
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