Inhaltsverzeichnis
Werbung
P7P55D-E LX� Motherboard Liste Qualifizierter Anbieter (QVL) DDR3-1333MHz
für CPU bei 2,66, 2,8 und 2,93GHz (Fortsetzung)
Anbieter
Artikelnummer
Crucial
CT25672BA1339.18FF
Crucial
BL25664BA1336.16SFB1
ELPIDA
EBJ10UE8BAW0-DJ-E
ELPIDA
EBJ21UE8BAW0-DJ-E
G.SKILL
F3-10600CL7D-2GBPI
G.SKILL
F3-10600CL8D-2GBHK
G.SKILL
F3-10666CL7T-6GBPK(XMP) 2048MB
G.SKILL
F3-10666CL8D-4GBHK(XMP) 4096MB(Kit of 2) DS N/A
G.SKILL
F3-10666CL9T-6GBNQ
GEIL
GV34GB1333C7DC
Hynix
HMT112U6BFR8C-H9
Hynix
HMT125U6BFR8C-H9
Hynix
HMT125U6BFR8C-H9
KINGMAX FLFD45F-B8EE9
KINGSTON KVR1333D3N9/1G
KINGSTON KVR1333D3N9/2G
KINGSTON KVR1333D3N9/2G
MICRON
MT8JTF12864AY-1G4BYES
MICRON
MT8JTF12864AZ-1G4F1
MICRON
MT8JTF12864AZ-1G4F1
MICRON
MT9JSF12872AZ-1G4F1
MICRON
MT16JF25664AZ-1G4F1
MICRON
MT16JTF25664AZ-1G4F1
MICRON
MT18JSF25672AZ-1G4F1
OCZ
OCZ3RPX1333EB2GK
OCZ
OCZ3G1333LV3GK
OCZ
OCZ3P1333LV3GK
OCZ
OCZ3P13332GK
OCZ
OCZ3P13334GK
OCZ
OCZ3G1333LV6GK
OCZ
OCZ3P1333LV6GK
OCZ
OCZX1333LV6GK(XMP)
SAMSUNG M378B2873DZ1-CH9
SAMSUNG M378B2873EH1-CH9
SAMSUNG M391B2873DZ1-CH9
SAMSUNG M378B5673DZ1-CH9
SAMSUNG M378B5673EH1-CH9
SAMSUNG M391B5673DZ1-CH9
SAMSUNG M378B5273BH1-CH9
Super Talent W1333UX2GB(XMP)
Transcend TS128MLK64V3U
Transcend TS256MLK64V3U
Asint
SLY3128M8-EDJ
Asint
SLY3128M8-EDJE
Asint
SLZ3128M8-EDJ
Asint
SLZ3128M8-EDJE
ASUS
N/A
BUFFALO
FSX1333D3G-1G
BUFFALO
FSH1333D3G-T3G(XMP)
BUFFALO
FSX1333D3G-2G
Patriot
PDC32G1333LLK
Patriot
PVT33G1333ELK
Patriot
PVS34G1333ELK
Patriot
PVS34G1333LLK
Patriot
PVT36G1333ELK
Silicon
SP001GBLTU133S02
Power
Silicon
SP002GBLTU133S02
Power
1-12
SS/
Größe
Chip-Marke Chip-Nr.
DS
2048MB
DS MICRON
4096MB(Kit of 2) DS NA
1024MB
SS ELPIDA
2048MB
DS ELPIDA
2048MB(Kit of 2) SS N/A
2048MB(Kit of 2) SS N/A
DS N/A
6144MB(Kit of 3) DS N/A
4096MB(Kit of 2) DS N/A
1024MB
SS Hynix
2048MB
DS Hynix
2048MB
DS Hynix
1024MB
SS ELPIDA
1024MB
SS ELPIDA
2048MB
DS ELPIDA
2048MB
DS ELPIDA
1024MB
SS MICRON
1024MB
SS MICRON
1024MB
SS MICRON
1024MB
SS MICRON
2048MB
DS MICRON
2048MB
DS MICRON
2048MB
DS MICRON
1024MB
SS N/A
3072MB(Kit of 3) SS N/A
3072MB(Kit of 3) SS N/A
1024MB
DS N/A
4096MB(Kit of 2) DS N/A
6144MB(Kit of 3) DS N/A
6144MB(Kit of 3) DS N/A
6144MB(Kit of 3) DS NA
1024MB
SS SAMSUNG K4B1G0846D
1024MB
SS SAMSUNG K4B1G0846E
1024MB
SS SAMSUNG K4B1G0846D(ECC)
2048MB
DS SAMSUNG K4B1G0846D
2048MB
DS SAMSUNG K4B1G0846E
2048MB
DS SAMSUNG K4B1G0846D(ECC)
4096MB
DS SAMSUNG K4B2G0846B-HCH9
2048MB(Kit of 2) SS N/A
1024MB
SS SAMSUNG K4B1G0846D
2048MB
DS SAMSUNG K4B1G0846D
1024MB
SS Asint
1024MB
SS ELPIDA
2048MB
DS Asint
2048MB
DS ELPIDA
1024MB
DS N/A
1024MB
SS N/A
3072MB(Kit of 3) SS N/A
2048MB
DS N/A
1024MB
SS PATRIOT
3072MB(Kit of 3) SS N/A
4096MB(Kit of 2) DS N/A
4096MB(Kit of 2) DS N/A
6144MB(Kit of 3) DS N/A
1024MB
SS S-POWER I0YT3E0
2048MB
DS S-POWER I0YT3E0
Timing
Dimm(Bios)
D9KPT(ECC)
9(1333-9-9-9-24)
Heat-Sink Package
6-6-6-20(1333-9-9-9-24) 1.8
J1108BABG-DJ-E
9(1333-9-9-9-24)
J1108BABG-DJ-E
9(1333-9-9-9-24)
Heat-Sink Package
(1337-7-7-7-18)
Heat-Sink Package
(1337-8-8-8-22)
Heat-Sink Package
7-7-7-18(1333-7-7-7-18) 1.5-1.6
Heat-Sink Package
8-8-8-21(1333-7-7-7-20) 1.5-1.6
Heat-Sink Package
9-9-9-24(1333-9-9-9-24) 1.5
Heat-Sink Package
7-7-7-24(1333-8-8-8-28) 1.5
H5TQ1G83BFR
9(1333-9-9-9-24)
H5TQ1G83BFR
9(1333-9-9-9-24)
H5TQ1G83BFRH9C
9(1333-9-9-9-24)
J1108BASE-DJ-E
(1333-9-9-9-24)
J1108BABG-DJ-E
9(1066-8-7-7-20)
J1108BABG-DJ-E
1333-9-9-9-24
J1108BABG-DJ-E
9(1066-8-7-7-20)
Z9HWR
(1333-9-9-9-24)
9FF22 D9KPT
9(1066-8-8-8-20)
D9KPT
9(1333-9-9-9-24)
D9KPT(ECC)
9(1333-9-9-9-24)
D9KPT
9(1333-9-9-9-24)
9FF22 D9KPT
9(1066-8-8-8-20)
D9KPT(ECC)
9(1333-9-9-9-24)
Heat-Sink Package
(1066-6-5-5-20)
Heat-Sink Package
9-9-9(1066-7-7-7-20)
Heat-Sink Package
7-7-7(1066-7-7-7-16)
Heat-Sink Package
7-7-7-20(1333-9-9-9-24)
Heat-Sink Package
7(1333-7-7-7-20)
Heat-Sink Package
9-9-9(1066-7-7-7-20)
Heat-Sink Package
7-7-7(1066-7-7-7-20)
Heat-Sink Package
8-8-8(1066-7-7-7-16)
9(1333-9-9-9-24)
1066-8-7-7-20
9(1333-9-9-9-24)
9(1333-9-9-9-24)
1066-8-7-7-20
9(1333-9-9-9-24)
9(1333-9-9-9-24)
Heat-Sink Package
8(1333-8-8-8-24)
9(1333-9-9-9-24)
9(1333-9-9-9-24)
DDRIII1208-DJ
(9-9-9-24)
J1108BASE-DJ-E
1066-8-8-8-20
DDRIII1208-DJ
(9-9-9-24)
J1108BASE-DJ-E
1066-8-8-8-20
Heat-Sink Package
(1333-9-9-9-24)
Heat-Sink Package
(1066-7-7-7-20)
Heat-Sink Package
7-7-7-20(1066-8-7-7-20)
Heat-Sink Package
(1066-7-7-7-20)
Heat-Sink Package
7(1337-7-7-7-20)
Heat-Sink Package
9-9-9-24(1066-7-7-7-20) 1.65
Heat-Sink Package
9-9-9-24(1066-7-7-7-20) 1.5
Heat-Sink Package
7-7-7-20(1066-7-7-7-20) 1.7
Heat-Sink Package
9-9-9-24(1066-7-7-7-20) 1.65
9(1333-9-9-9-24)
9(1333-9-9-9-24)
Kapitel 1: Produkteinführung
DIMM-Sockel-
Unterstützung
Spannung
(Opt.)
A*
B*
C*
•
•
•
•
•
•
•
•
•
•
•
•
1.65
•
•
1.65
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.5
•
•
•
1.5
•
•
•
1.5
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.65
•
•
1.65
•
•
•
•
•
1.8
•
•
•
1.65
•
•
•
1.65
•
•
•
1.6
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.8
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.7
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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