In Win 703 Bedienungsanleitung

lish
User Manual En
Package Content
7 1.70 1
2.1ber x I
3.Acc—t.s x :
oard a.Mottterb / Add-m Card S crew xIS
b.StondOffSocket X I
Stmd0tt 3
aooo screwt2. s• HDO Screw x to
f.HD D Proof Shock- Stmdx 16
g.cæe 00 x 3
Structure
.Ciea Sde Pane!
Exomoon Sot
- i .+ower&JttM.
Arronqerneqt_
S.OS B 2.0 pod_
fm Au Fiter
i5.12(yrvn Bottom Fon Area.
4.usa 3.0 pod
- g .AucS 0 Pods (Earphone ord
coge_
&5.25• DriveBayCoy«__
ii.iool-ftep_ M ountftp
th•st-free CPU Coobf
8.powerSups*y_ M ount"'ig
i9.Water-CooUng
. Motherboar €0 d Motnting Areg
IN vlJIN
In Win Development Inc.
Copyright @2014 In Win Develop ment Inc. All Rights d. Reserve
3RAMEE030502
2.CÆ$ß x
f. 16
11.
Specifications
Mid Tower
case Sire
SECCsteel
5.25" 1
External Bay
3."/ 2.5" 4 (Supports up to SATAEZ.Swap Module x4)
Internal Orwe Bay
ATX, Micro-ATX
Form Factor 12V, PS" sue and E PS up to220mm with b ottom
Power
use 3.0 x 1
2.0 2
HO
Supports High-end Graphic Card upto
Front- FÜ'X2
Rear LED Fan
Bonom - Fan x i
Thermal Sol•mon
CPU up to
Water-Coolitv H ole Ready
432 210
Dimension
Net weight
6.3 ug
Gross Weight
• with RoHS
• Speci6c.Oom may v ary b ased on different
Noticesand Warranty))
noose fo•ow u ser Étstructiorg for • uta110tion.
2.wt„ue the protection and to avoid
to me s ystem b,uacser md/or the d tyroøe to the c ornponentc incorrect rutallaoon
3 operation cause domoøe of t o the system. detects darnoge
ftom i nproper operot•onwill be exeudOd from w ryronty covotOW.
4.Any modification may ttw prodLx:t
and rernove all internal devices betore or (lnc•udng
wppty. hard drive. CD-ROM. motherboard. CPU. etc)
6.For more detailed warranty the in retou website at w ww.jrr
7.Th0 octud product bsubject to without prior notice. D eveloptnent
rewrvæ the •t tomake m al m odificatiorø.
• user Manual
• Manuel de
• Wenungsanleitung
• Manualdel usuario
• pygo.oac«o n o•gcnnyarauøø
Version 2.0
IN V'JIN
MID-TOWER
SECCEWØ€E*
sas- x 2
35/2.5- x
A" 1Micro-ATX
AßATX 12V PS11,
USB3.ox1
USB2.ox2
HD Audio
n - M120mmUx 2
-M120mmLEDAn x i
- M120mmmn x i
432
(HxWxD) 8.rx 18.8•
5.4M
6.3QF
• (ROHS)
Installation Guide
Openin the Chassis
Add-onCardPCI-E Installation
may
resultf,g
power
1/0 WiresInstallation
VIEW
HD Audo Header
5.25", 3.5" a nd 2.5" D rive B ays I nstallation
6-1. ODDInstallation
Thermal Solution System Installationtion:
7-1.Front F anInstallation
Remove the front panel and anti-dust fitter
4)
Thermal Solution System I nstallationtion.
7-2.Bottom FanInstallation
(Please follow the related chapters toassemble)
PowerSupply Installation
1/0 WiresInstallation
to MB
USB3.0 Header
6-1. ODDInstallation
LEO
LED
Switch/LED Connector
6-2. HDDInstallation
-3.5" HDD or 2.5" HDD
-The top&bottom ot2.5"HDD
3.5 HDD
Install thefront f anandanti-dust fitter
Cable Management
Parts R equired:Motherboard screws
/ Motherboard s tandoffs
/ Stand-Off S ocket
USB2.0 Header
Parts Required: 2.5"HDD Screws
(Parts Roqu"ed: 2.5" H DD S crews)
2.5 HDD
CompletingInstallation