ANNEX - ENVIROMENTAL INFORMATION
The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People's Republic of China
Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products.
Part
Name
Semiconductor die
Solder
附件 - 环保信息
此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和国电子行业标准 SJ/T11364 - 2006,
电子信息产品污染控制标识要求。
部
件
名称
半导体芯片
焊接点
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Toxic or hazardous Substance and Elements
Lead
Mercury
Cadmium
(Pb)
(Hg)
(Cd)
铅
汞
镉
(Pb)
(Hg)
(Cd)
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DataSheet
Hexavalent
Polybrominated
Chromium
biphenyls
(Cr (VI))
(PBB)
有毒有害物质或元素
六价铬
多溴联苯
(Cr (VI))
(PBB)
50
Accessories
Polybrominated
diphenyl ethers
(PBDE)
多溴二苯醚
(PBDE)